BACKING MATERIAL FOR MICROMACHINED ULTRASONIC TRANSDUCER DEVICES
First Claim
1. A micromachined ultrasonic transducer device comprising:
- an ultrasonic transducer array micromachined on a substrate;
flexible electrical connections connected to said ultrasonic transducer array; and
a body of acoustically attenuative material that supports said substrate and said flexible electrical connections.
1 Assignment
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Accused Products
Abstract
RD-28,709 22An ultrasonic transducer device comprising: an ultrasonic transducer array micromachined on a substrate; flexible electrical connections connected to the transducer array; and a body of acoustically attenuative material that supports the substrate and the flexible electrical connections. The acoustic backing material may contain additional features, such as tabs or notches, for use in positioning the transducer on fixtures during manufacturing or positioning the transducer within a housing during final assembly. Tabs or other features that are used only during manufacturing may be subsequently removed from the device. The MUT device itself may also be thinned so as to provide flexibility as desired. The backing material is preferably matched in acoustic impedance to the silicon wafer so as to prevent reflection at the interface of any acoustic energy propagating rearward, i.e., in the direction away from the device front surface. The backing material may also possess a high thermal conductivity to assist in removal of heat from the device.
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Citations
34 Claims
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1. A micromachined ultrasonic transducer device comprising:
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an ultrasonic transducer array micromachined on a substrate;
flexible electrical connections connected to said ultrasonic transducer array; and
a body of acoustically attenuative material that supports said substrate and said flexible electrical connections. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. An ultrasound transducer comprising:
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a silicon substrate;
an array of ultrasonic transducer cells supported by said silicon substrate; and
a body of acoustically attenuative material disposed on a side of said substrate opposite to said array, said acoustically attenuative material comprising tungsten particles dispersed in a matrix material, wherein the mass percent of tungsten lies in the range of 96.0% to 96.65%, with the remainder being said matrix material, and wherein a first fraction of said tungsten particles have a particle size on the order of 1 micron and a second fraction of said tungsten particles have a particle size on the order of 10 microns. - View Dependent Claims (14, 15)
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16. An ultrasound transducer comprising:
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a silicon substrate;
an array of ultrasonic transducer cells supported by said silicon substrate;
a body of acoustically attenuative material disposed on a side of said substrate opposite to said array; and
a layer of acoustic impedance matching material disposed between said substrate and said body of acoustically attenuative material, the acoustic impedance of said acoustic impedance matching material having a value that lies between the acoustic impedance of silicon and the acoustic impedance of said acoustically attenuative material. - View Dependent Claims (17, 18, 19)
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20. An ultrasound transducer comprising:
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a silicon substrate;
an array of ultrasonic transducer cells supported by said silicon substrate; and
a body of acoustically attenuative material disposed on a side of said substrate opposite to said array, said acoustically attenuative material comprising tungsten particles and particles of highly thermally conductive filler material dispersed in a matrix material. - View Dependent Claims (21, 22, 23, 24)
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25. A method of manufacturing an ultrasound transducer comprising the following steps:
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attaching a substrate to a layer of acoustic backing material;
thinning said substrate while it is attached to said layer of acoustic backing material; and
micromachining an array of ultrasonic transducer cells on said substrate. - View Dependent Claims (26, 27, 28)
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29. A method of manufacturing an ultrasound transducer comprising the following steps:
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micromachining an array of ultrasonic transducer cells on a substrate;
attaching a front face of said array to a support membrane;
thinning said substrate while supported by said support membrane;
attaching a formed or conformal layer of backing material to said thinned substrate; and
removing said supporting membrane. - View Dependent Claims (30, 31, 32)
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33. A micromachined ultrasonic transducer device comprising:
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an ultrasonic transducer array micromachined on a generally rectangular substrate;
flexible electrical connections connected to said ultrasonic transducer array; and
a body of acoustically attenuative material that supports said substrate and extends beyond opposing sides of said substrate.
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34. A method of manufacturing an ultrasound transducer comprising the following steps:
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attaching a substrate having a first area to a layer of acoustic backing material having a second area greater than said first area, said substrate being placed so that respective portions of said layer of acoustic backing material extend beyond opposing side edges of said substrate;
thinning said substrate while it is attached to said layer of acoustic backing material;
micromachining an array of ultrasonic transducer cells on said substrate; and
trimming off said respective portions of said layer of acoustic backing material subsequent to said micromachining step.
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Specification