Optical information processing circuit assembly
First Claim
1. An optical information processing circuit assembly, the assembly comprising:
- a first optically transmissive substrate;
a resiliently compressible circuit member affixed to said first substrate and defining a first opening therethrough with a number of electrically conductive leads disposed about said first opening; and
an integrated circuit having a surface defining a number of electrically conductive pads disposed about an imaging circuit, each of said number of electrically conductive pads electrically contacting corresponding ones of said number of electrically conductive leads with said surface of said integrated circuit facing said first substrate through said first opening defined through said resiliently compressible circuit member.
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Accused Products
Abstract
An optical information processing circuit assembly includes an optically transmissive substrate and a resiliently compressible circuit member affixed to the substrate and defining an opening therethrough with a number of leads disposed about the opening. An integrated imaging circuit defines a corresponding number of pads wherein the pads align with and electrically contact the leads. An optically transmissive medium may be disposed between and in contact with the substrate and the integrated imaging circuit to allow light transmission therethrough from the substrate to the imaging circuit. In one embodiment, resilient bumps are provided between the integrated imaging circuit and the resiliently compressible circuit member to form the electrical connection therebetween. Alternatively, solder bumps may replace the resilient bumps. Additional circuit components may be similarly mounted to the resiliently compressible circuit member to complete the assembly.
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Citations
23 Claims
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1. An optical information processing circuit assembly, the assembly comprising:
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a first optically transmissive substrate;
a resiliently compressible circuit member affixed to said first substrate and defining a first opening therethrough with a number of electrically conductive leads disposed about said first opening; and
an integrated circuit having a surface defining a number of electrically conductive pads disposed about an imaging circuit, each of said number of electrically conductive pads electrically contacting corresponding ones of said number of electrically conductive leads with said surface of said integrated circuit facing said first substrate through said first opening defined through said resiliently compressible circuit member. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A method of assembling an optical information processing circuit, the method comprising the steps of:
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providing an optically transmissive substrate;
affixing a resiliently compressible circuit member to one side of said substrate, said resiliently compressible circuit member defining an opening therethrough with a number of electrically conductive leads disposed about said opening;
dispensing a formable optically transmissive medium onto said substrate through said opening and onto said resiliently compressible circuit member adjacent to said opening;
aligning a number of electrically conductive pads defined on one surface of an integrated imaging circuit with corresponding ones of said number of electrically conductive leads, each of said number of electrically conductive pads having a resilient bump affixed thereto;
embedding said integrated imaging circuit into said formable optically transmissive medium and applying heat and compression to said integrated imaging circuit to compress said resilient bumps onto said electrically conductive leads; and
curing said formable optically transmissive medium while said integrated imaging circuit is under compression until said formable optically transmissive medium bonds to said substrate, said resiliently compressible circuit member and said integrated imaging circuit.
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21. A method of assembling an optical information processing circuit, the method comprising the steps of:
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providing an optically transmissive substrate;
affixing a resiliently compressible circuit member to one side of said substrate, said resiliently compressible circuit member defining an opening therethrough with a number of electrically conductive leads disposed about said opening;
dispensing a formable optically transmissive medium onto said substrate through said opening and onto said resiliently compressible circuit member adjacent to said opening;
aligning a number of electrically conductive pads defined on one surface of an integrated imaging circuit with corresponding ones of said number of electrically conductive leads, each of said number of electrically conductive pads having a solder bump affixed thereto;
embedding said integrated imaging circuit into said formable optically transmissive medium and with said solder bumps in contact with corresponding ones of said number of electrically conductive leads; and
heating said substrate, resiliently compressible circuit member and integrated imaging circuit to simultaneously reflow said solder bumps and cure said formable optically transmissive medium.
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22. A method of assembling an optical information processing circuit, the method comprising the steps of:
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providing an optically transmissive substrate;
affixing a resiliently compressible circuit member to one side of said substrate, said resiliently compressible circuit member defining an opening therethrough with a number of electrically conductive leads disposed about said opening;
aligning a number of electrically conductive pads defined on one surface of an integrated imaging circuit with corresponding ones of said number of electrically conductive leads, each of said number of electrically conductive pads having a solder bump affixed thereto;
bringing said solder bumps in contact with corresponding ones of said number of electrically conductive leads; and
reflowing said solder bumps to mechanically and electrically attach said number of electrically conductive pads to corresponding ones of said number of electrically conductive lead. - View Dependent Claims (23)
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Specification