Mixed analog and digital chip-scale reconfigurable WDM network
First Claim
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1. A mixed analog and digital chip-scale wavelength selective router, the router comprising:
- a plurality of optical de-multiplexers couplable to a fiber optic input for separating light into a plurality of wavelengths, the plurality of wavelengths including a first range of wavelengths and a second range of wavelengths;
a first optical component configured to receive the first range of wavelengths and to programmably separate the first range of wavelengths into a first plurality of channels;
a second optical component configured to receive the second range of wavelengths and to programmably separate the second range of wavelengths into a second plurality of channels; and
a plurality of optical multiplexers in optical communication with the first and second optical components.
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Abstract
The present invention provides a mixed analog and digital chip-scale reconfigurable WDM network. The network suitably includes a router that enables rapidly configurable wavelength selective routers of fiber optic data. The router suitably incorporates photonic wavelength selective optical add/drop filters and multiplexers.
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Citations
47 Claims
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1. A mixed analog and digital chip-scale wavelength selective router, the router comprising:
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a plurality of optical de-multiplexers couplable to a fiber optic input for separating light into a plurality of wavelengths, the plurality of wavelengths including a first range of wavelengths and a second range of wavelengths;
a first optical component configured to receive the first range of wavelengths and to programmably separate the first range of wavelengths into a first plurality of channels;
a second optical component configured to receive the second range of wavelengths and to programmably separate the second range of wavelengths into a second plurality of channels; and
a plurality of optical multiplexers in optical communication with the first and second optical components. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A method for routing optical signals on a chip, the method comprising:
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configuring a first optical component to direct a first optical signal to a first optical multiplexer according to a wavelength of an optical signal;
configuring a second optical component to direct a second optical signal to a second optical multiplexer according to the wavelength of the optical signal;
directing an optical signal received at an optical demultiplexer to the first or the second optical component according to the wavelength of the optical signal;
directing an optical signal received at the first optical component to the first optical multiplexer; and
directing an optical signal received at the second optical component to the second optical multiplexer. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. A silicon chip for routing analog and digital optical signals, the chip comprising:
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a refractive optical component configured to receive an optical signal at an input and to direct the optical signal according to a wavelength associated with the optical signal;
a first configurable optical component in optical communication with the refractive optical component to receive optical signals, the wavelength within a first range of wavelengths, the first configurable optical component being configured to direct the optical signal to a first destination according to the wavelength associated with the signal; and
a second configurable optical component in optical communication with the refractive optical component, the wavelength being within a second range of wavelengths, the second configurable optical component being configured to direct the optical signal to a second destination according to the wavelength associated with the signal. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43)
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44. A method of manufacturing a silicon chip for routing analog and digital optical signals, the method comprising:
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providing a SOI wafer;
growing a perovskite interfacial layer on the SOI wafer, the perovskite interfacial layer being configured as an optical emitting structure of a microresonator;
growing a low refractive index optical isolation layer on the perovskite interfacial layer;
growing a first low carrier confinement layer on the low refractive index optical isolation layer;
growing an InGaAsN quantum well active layer on the first low carrier confinement layer;
growing a second low carrier confinement layer on the InGaAsN quantum well active layer. - View Dependent Claims (45, 46, 47)
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Specification