×

Affinity based self-assembly systems and devices for photonic and electronic applications

  • US 20040115696A1
  • Filed: 07/31/2003
  • Published: 06/17/2004
  • Est. Priority Date: 12/06/1996
  • Status: Abandoned Application
First Claim
Patent Images

1. A method for forming a multiple identity substrate material comprising the steps of:

  • providing a first affinity sequence at multiple locations on a support;

    providing a functionalized second affinity sequence, which reacts with the first affinity sequence, and has an unhybridized overhang sequence; and

    selectively cross-linking first affinity sequences and second affinity sequences.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×