Metal deposition process with pre-cleaning before electrochemical deposition
First Claim
Patent Images
1. A method comprising:
- providing a substrate having a metal seed layer;
applying an agitated rinse to the metal seed layer; and
depositing a metal fill layer on the rinsed metal seed layer by electrochemical deposition.
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Abstract
A metal seed layer on a substrate is pre-cleaned prior to formation of an electrochemically deposited metal fill layer. A liquid-based pre-clean may include, for example, an agitated rinse, an etchant solution, a surfactant solution and/or a solvent-solution to remove organic and/or other contaminants from the metal seed layer. A dry pre-clean may utilize, for example, a hydrogen and/or an oxygen plasma to remove contaminants and/or reduce a metal oxide of the seed layer. In at least one embodiment, the reduction of the metal oxide may occur at a pressure in excess of 0.1 atmosphere.
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Citations
27 Claims
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1. A method comprising:
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providing a substrate having a metal seed layer;
applying an agitated rinse to the metal seed layer; and
depositing a metal fill layer on the rinsed metal seed layer by electrochemical deposition. - View Dependent Claims (2, 3, 4)
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5. A method comprising:
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providing a substrate having a metal seed layer;
exposing the metal seed layer to a liquid that includes a surfactant; and
depositing a metal fill layer on the metal seed layer by electrochemical deposition. - View Dependent Claims (6, 7, 8, 9)
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10. A method comprising:
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providing a substrate having a metal seed layer;
exposing the metal seed layer to an organic solvent; and
depositing a metal fill layer on the metal seed layer by electrochemical deposition. - View Dependent Claims (11, 12, 13, 14)
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15. A method comprising:
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providing a substrate having a metal seed layer;
exposing the metal seed layer to activated hydrogen at a pressure of at least 0.1 atmosphere; and
depositing a metal fill layer on the metal seed layer by electrochemical deposition. - View Dependent Claims (16, 17, 18, 19, 20)
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21. A method comprising:
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providing a substrate having a metal seed layer;
exposing the metal seed layer to an oxidant solution so as to form an oxidized surface layer on the metal seed layer; and
depositing a metal fill layer on the metal seed layer by electrochemical deposition. - View Dependent Claims (22, 23, 24, 25, 26, 27)
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Specification