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Metal deposition process with pre-cleaning before electrochemical deposition

  • US 20040118697A1
  • Filed: 10/01/2003
  • Published: 06/24/2004
  • Est. Priority Date: 10/01/2002
  • Status: Abandoned Application
First Claim
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1. A method comprising:

  • providing a substrate having a metal seed layer;

    applying an agitated rinse to the metal seed layer; and

    depositing a metal fill layer on the rinsed metal seed layer by electrochemical deposition.

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