Input/output coupling structure for dielectric waveguide resonator

• US 20040119564A1
• Filed: 12/03/2003
• Published: 06/24/2004
• Est. Priority Date: 12/06/2002
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: TOKO Incorporated (Murata Manufacturing Co Limited)
• Inventors: Itoh, Kazuhiro, Sano, Kazuhisa
• Granted Patent: US 6,977,560 B2
• Time in Patent Office: Days
• US Class Current: 333/208
• CPC Class Codes: H01P 1/2088 Integrated in a substrate
• CPC Class Codes: H01P 5/1022 Transitions to dielectric waveguide
• CPC Class Codes: H01P 5/107 Hollow-waveguide/strip-line transitions

Abstract

Disclosed is an input/output coupling structure for a dielectric waveguide resonator to be mounted on a printed circuit board, which comprises; a region defined in the printed circuit board and surrounded by a first conductive film formed on the front surface of the printed circuit board and connected to a microstrip line on the printed circuit board, a second conductive film formed on the back surface of the printed circuit board, and a conductive wall connecting the respective peripheries of the first and second conductive films; a first slot formed in the front surface of the region; and a second slot formed in a surface of the dielectric waveguide resonator which is disposed to be opposed to the region of the printed circuit board. The first and second slots are adapted to be disposed in opposed relation to one another. The coupling structure can achieve the connection between a dielectric waveguide resonator and a microstrip line without forming any input/output electrode on the resonator, to facilitate the application of the dielectric waveguide resonator to an electronic circuit even if it is intended to be used in millimetric-wave band.

Claims

1. An input/output coupling structure for a dielectric waveguide resonator to be mounted on a printed circuit board, comprising:

a region defined in said printed circuit board, said region being surrounded by a first conductive film, a second conductive film and a conductive wall, said first conductive film being formed on the front surface of said printed circuit board and connected to a microstrip line on said printed circuit board, said second conductive film being formed on the back surface of said printed circuit board, said conductive wall connecting the respective peripheries of said first and second conductive films;

a first slot formed in the front surface of said region; and

a second slot formed in a surface of said dielectric waveguide resonator, said surface of said dielectric waveguide resonator being disposed to be opposed to said region of said printed circuit board,

wherein said first and second slots are adapted to be disposed in opposed relation to one another.

2. The input/output coupling structure as defined in claim 1, wherein said conductive wall is formed of a plurality of through-holes filled with conductive material.

3. An input/output coupling structure for a dielectric waveguide resonator to be mounted on a printed circuit board, comprising:

a mode conversion region defined in said printed circuit board, said region being surrounded by a first conductive film, a second conductive film and a conductive wall, said first conductive film being formed on the front surface of said printed circuit board and connected to a TEM-mode microstrip line on said printed circuit board, said second conductive film being formed on the back surface of said printed circuit board, said conductive wall connecting the respective peripheries of said first and second conductive films;

a first slot formed in the front surface of said region; and

a second slot formed in a surface of said dielectric waveguide resonator, said surface of said dielectric waveguide resonator being disposed to be opposed to said region of said printed circuit board,

wherein said first and second slots are adapted to be disposed in opposed relation to one another to achieve TE mode coupling.

4. The input/output coupling structure as defined in claim 3, wherein said conductive wall is formed of a plurality of through-holes filled with conductive material.