Light-emitting apparatus

• US 20040120155A1
• Filed: 10/16/2003
• Published: 06/24/2004
• Est. Priority Date: 04/17/2001
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: Suenaga, Ryoma
• Granted Patent: US 7,019,335 B2
• Time in Patent Office: Days
• US Class Current: 362/362
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45139 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/4823 connecting the wire to a pin of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01021 : Scandium [Sc]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/0103 : Zinc [Zn]
• CPC Class Codes: H01L 2924/01032 : Germanium [Ge]
• CPC Class Codes: H01L 2924/01038 : Strontium [Sr]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01052 : Tellurium [Te]
• CPC Class Codes: H01L 2924/01056 : Barium [Ba]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01058 : Cerium [Ce]
• CPC Class Codes: H01L 2924/01059 : Praseodymium [Pr]
• CPC Class Codes: H01L 2924/0106 : Neodymium [Nd]
• CPC Class Codes: H01L 2924/01063 : Europium [Eu]
• CPC Class Codes: H01L 2924/01065 : Terbium [Tb]
• CPC Class Codes: H01L 2924/01066 : Dysprosium [Dy]
• CPC Class Codes: H01L 2924/01073 : Tantalum [Ta]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/12036 : PN diode
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H01L 33/483 : Containers
• CPC Class Codes: H01L 33/507 : the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 : characterized by the shape

Abstract

A light emitting device comprises a light emitting element, a metal package having a recess part for housing the light emitting element and a base part which has one or more through holes, one or more lead electrode pins which penetrate the through holes and are separated from the through holes by a insulating member respectively, wherein the bottom faces of the lead electrode pins project out from the bottom face of the base part and positioned on a same plane including a outer bottom face of the recess part. With this configuration, the light emitting device which has a good heat radiating characteristic and high mechanical strength.

Claims

1. A light emitting device comprising:

a light emitting element,

a metal package having a recess part for housing said light emitting element and a base part which has one or more through holes,

one or more lead electrode pins penetrating said through holes respectively, said lead electrode pins being separated from said through holes by a insulating member,

wherein bottom faces of said lead electrode pins project out from the bottom face of said base part and positioned on a same plane including a outer bottom face of said recess part.

2. The light emitting device according to claim 1:

wherein a thickness of said base part is thicker than the thickness of said recess part.

3. The light emitting device according to claims 1 or 2:

wherein the inner wall of said recess part is tapered wall.

4. The light emitting device as in one of claims 1 to 3:

further comprising a transparent sealing member covering said light emitting element in the recess, said transparent sealing member including phosphor material capable of emitting light having a wavelength different from that of the light emitted from the light emitting element by absorbing the light emitted from said light emitting element.

5. The light emitting device as in one of claims 1 to 4:

further comprising a lid composed of a metal part and a transparent window part on said metal package, said transparent window part opposing to the recess part and being crossed a line extended from an inner wall of said recess part.

6. The light emitting device as in one of claims 1 to 5:

wherein said metal package having a thermal conductivity in a range from 10 W/m·

K to 100 W/m·

K and a thermal expansion coefficient in a range from 0.05×

10<sup>−

4</sup>/deg to 0.20×

10<sup>−

4</sup>/deg.

7. The light emitting device as in one of claims 1 to 5:

wherein said recess part has a brim part projecting from said base part.

8. The light emitting device as in one of claims 5 to 7:

wherein said transparent window part is crossed a line that links a rising edge point of said inner wall of said recess and a ending edge point of said inner wall of said recess, said ending edge point and said rising edge point facing each other with said light emitting element between.

9. A light emitting device comprising:

a light emitting element,

a metal package having a thin part for mounting said light emitting element and a thick part which elongates from said thin part to outside, said thick part having one or more lead electrodes integrally, said lead electrode pins being separated from said thick part by a insulating member,

wherein bottom faces of said lead electrode pins project out from the bottom face of said thick part and positioned on a same plane including a outer bottom face of said thin part.

10. The light emitting device according to claim 9:

wherein said thin part is parallel to said thick part and a boundary part between said thin part and said thick part is bent.