Mounting arrangement for high-frequency electro-optical components

• US 20040120370A1
• Filed: 08/07/2003
• Published: 06/24/2004
• Est. Priority Date: 08/13/2002
• Status: Active Grant

• Current Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Original Assignee: Agilent Technologies, Inc.
• Inventors: Lupo, Silvio
• Granted Patent: US 7,558,303 B2
• Time in Patent Office: Days
• US Class Current: 372/36
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/4903 Connectors having different sizes, e.g. different diameters
• CPC Class Codes: H01L 2224/4917 Crossed wires
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01S 5/02325 Mechanically integrated components on mount members or optical micro-benches
• CPC Class Codes: H01S 5/02345 Wire-bonding
• CPC Class Codes: H01S 5/0427 for applying modulation to the laser
• CPC Class Codes: H01S 5/06226 Modulation at ultra-high frequencies

Abstract

An auxiliary component such as a bias inductance (6) associated with a laser source (2) is mounted generally “upright”, that is with its major dimension substantially orthogonal to the general plane of the submount (S) supporting both the laser (2) and the auxiliary component (6). The inductor (6) is preferably mounted at a location displaced laterally with respect to the lasing direction (X) of the laser source. The arrangement preferably includes a submount (S) with a recess (13) and at least part of the laser driver is arranged in the recess so that the driver (3) has an end surface extending from the recess substantially flush with the pad (12) for mounting the laser source. The arrangement minimises surface occupation as well as RF and EMI parasitic effects related to wirebonding.

Claims

1. A mounting arrangement for a laser source (2) and at least one auxiliary component (6) associated therewith, said at least one auxiliary component having a major dimension, said laser source (2) and said auxiliary component (6) being mounted on a submount (S) having a general plane of extension, characterised in that said at least one auxiliary component (6) is mounted with said major dimension substantially orthogonal to said general plane of said submount (S).

2. The mounting arrangement of claim 1, characterised in that said auxiliary component is a bias inductance (6) for said laser source (2).

3. The mounting arrangement of either of claims 1 or 2, characterised in that said laser source has a lasing direction (X) and said auxiliary component is displaced laterally with respect to said lasing direction (X) of said laser source (2).

4. The mounting arrangement of claim 3, characterised in that said laser source (2) includes front (2a) and back (2b) lasing facets aligned along said lasing direction (X), said auxiliary component (6) has a surface exposed to radiation from said back facet (2b) of the laser source (2), and in that said surface is tilted laterally with respect to said lasing direction (X) so that radiation from said laser back facet (2b) along said lasing direction (X) is reflected away from such direction.

5. The mounting arrangement of any of the previous claims, characterised in that said at least one auxiliary component (6) is mounted onto said submount (3) by means of conductive glue (15).

6. The mounting arrangement of any of the previous claims, characterised in that said at least one auxiliary component (6) is in the form of an SMD component.

7. The mounting arrangement of any of the previous claims, characterised in that it includes an electrically conductive area or pad (12) onto which both said laser source (2) and said auxiliary component (6) are mounted.

8. The mounting arrangement of any of the previous claims, characterised in that it includes an electrically conductive area or pad (12) for mounting said laser source (2) as well as a driver (3) for said laser source (2), and in that said submount (S) has an outer surface (S′

) and a recess (13) recessed with respect to said outer surface (S′

), wherein at least part of said laser driver (3) is arranged in said recess (13) so that the driver has an end surface extending from the recess substantially flush with said conductive pad (12) for mounting said laser source (2).