Structure and method of thermally protecting power devices for airbag deployment

• US 20040120382A1
• Filed: 12/19/2002
• Published: 06/24/2004
• Est. Priority Date: 12/19/2002
• Status: Active Grant

• Current Assignee: NXP USA, Inc. (NXP Semiconductors NV)
• Original Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Inventors: Tom Lee, Tien-Yu, Chiriac, Victor A., Edwards, William E., Bennett, Paul T., Putti, David D.
• Granted Patent: US 6,906,900 B2
• Time in Patent Office: Days
• US Class Current: 374/45
• CPC Class Codes: B60R 21/0173 Diagnostic or recording means therefor
• CPC Class Codes: H02H 5/044 using a semiconductor device to sense the temperature

Abstract

System and method protects power drivers (10) and (12) that are used for airbag deployment. Temperature sensors (38) are strategically located on the integrated circuit (36) to detect temperature levels in power drivers (10) and (12). When the temperature in the power drivers (10) and (12) reaches a maximum level, an output is provided to logic block (26). Current detecting circuit (24) provides an output when the current flowing in power driver (10) reaches a desired level. Timing circuit (28) is activated when it receives the output from current detecting circuit (24). At the expiration of the time, timing circuit (28) provides an output to logic block (26). When logic block (26) receives both outputs, logic block (26) shuts drivers (10) and (12) down. When temperature sensors (38) detects that the temperature in integrated circuit (36) has reached a minimum level, logic block (26) reactivates drivers (10) and (12).

Claims

1. A thermal protection system for an integrated circuit supporting a power driver, comprised of:

a thermal sensor placed along an edge of said integrated circuit next to said power driver to detect a temperature level near said power driver;

a current detecting circuit coupled to said power driver to detect a current level in said power driver;

a current limiting circuit coupled to said power driver to limit said current level in said power driver;

a logic block to regulate said power driver, wherein said logic block is coupled to said thermal sensor, said power driver, and said current detecting circuit; and

a timing circuit coupled to said logic block, wherein said logic block receives a first output from said timing circuit and a second output from said thermal sensor.

2. The system of claim 1, further comprising a current data recorder to record current data from said power driver.

3. The system of claim 2, wherein said timing circuit receives a current input from said current detecting circuit.

4. The system of claim 1, further comprising a controller coupled to said logic block and said power driver in between said logic block and said power driver, wherein said controller regulates the operation of said power driver.

5. The system of claim 1, wherein said logic block deactivates said power driver when said logic block receives said first output.

6. The system of claim 1, wherein said logic block deactivates said power driver when said logic block receives said second output.

7. The system of claim 1, further comprising a semiconductor wafer with a thickness to absorb a sufficient amount of thermal energy from said power driver to enable said thermal sensor to detect a variation of said temperature level near said power driver, said semiconductor wafer supports said power driver and said logic block.

8. A method for thermally protecting a power device on an integrated circuit, comprising the steps of:

activating a power driver to deploy a current;

sensing said current flowing through said power driver;

providing a first output to a logic block when said current reaches a desired level;

activating a timing circuit;

measuring a length of time;

providing a second output at the expiration of said length of time to said logic block; and

deactivating said power driver.

9. The method of claim 8, further comprising the steps of:

measuring a second length of time;

providing a third output at the expiration of said second length of time to said logic block; and

reactivating said power driver.

10. The method of claim 8, further comprising the steps of;

providing a fourth output to said logic block when a temperature of said integrated circuit reaches a maximum level.

11. The method of claim 10, wherein deactivating said power driver occurs when said logic block has received both said second output and said fourth output.

12. The method of claim 11, further comprising the steps of:

providing a fifth output to said logic block when the temperature of said integrated circuit reaches a minimum level; and

reactivating said power driver.

13. The method of claim 8, further comprising the step of recording a data on said current pulse.

14. The method of claim 8, further comprising the step of regulating said current in said driver with a current limiting circuit.

15. A thermal protection system for an airbag deployment system, comprised of:

current limiting means to regulate a flow of a current through a power driver;

timing means to mark a period of time and provide a timing output at an expiration of said time period;

current detecting means to provide a first output when said current in said power driver reaches a desired level;

triggering means to activate said timing means when said current reaches said desired level based upon said first output;

logic means to turn said power driver OFF when said logic means receives said timing output.

16. The thermal protection system of claim 15, further comprising memory means to record data on said current flowing through said power driver.

17. The thermal protection system of claim 15, further comprising temperature sensing means positioned along an edge of an integrated circuit next to a power driver to sense a temperature within said power driver, wherein said temperature sensing means is coupled to said logic means.

18. The thermal protection system of claim 17, wherein said temperature sensing means provides a first temperature output to said logic means when said temperature reaches a maximum level.

19. The thermal protection system of claim 17, wherein said temperature sensing means provides a second temperature output to said logic means when said temperature reaches a minimum level.

20. The thermal protection system of claim 19, wherein said logic means to turn said power driver OFF when said logic means receives said timing output and said first temperature output.

21. The thermal protection system of claim 20, wherein said logic means turns said power driver ON when said logic means receives said second temperature output.