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Process for forming a pattern

  • US 20040121594A1
  • Filed: 11/14/2003
  • Published: 06/24/2004
  • Est. Priority Date: 12/20/2002
  • Status: Active Grant
First Claim
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1. A process for forming a pattern comprising:

  • preparing a substrate;

    forming a workpiece film on the surface of the substrate, forming a resist film on top of the workpiece film;

    disposing a mask on the surface of the substrate, and irradiating the resist film with a first energy beam through the mask;

    forming a first resist pattern on the surface of the substrate by developing the resist film after applying the first energy beam;

    irradiating the first resist pattern with a second energy beam after removal of the mask;

    forming a second resist pattern smaller than the first resist pattern by subjecting the first resist pattern to heat treatment after applying the second energy beam; and

    patterning the workpiece film by use of the second resist pattern as a mask.

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