Fabrication system and manufacturing method of light emitting device

• US 20040123804A1
• Filed: 09/19/2003
• Published: 07/01/2004
• Est. Priority Date: 09/20/2002
• Status: Abandoned Application

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Kuwabara, Hideaki, Yamazaki, Shunpei, Murakami, Masakazu
• Application Number:
  US10/664,642
• Publication Number:
  US 20040123804A1
• Time in Patent Office: Days
• US Class Current: 118/723VE
• CPC Class Codes: C23C 14/046 Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
• CPC Class Codes: C23C 14/12 Organic material
• CPC Class Codes: C23C 14/246 Replenishment of source material
• CPC Class Codes: C23C 14/564 Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H10K 59/12 Active-matrix OLED [AMOLED] displays
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/164 using vacuum deposition

Abstract

The present invention provides a vapor deposition method and a vapor deposition system of film formation systems by which EL materials can be used more efficiently and EL materials having superior uniformity with high throughput rate are formed. According to the present invention, inside a film formation chamber, an evaporation source holder in a rectangular shape in which a plurality of containers sealing evaporation material is moved at a certain pitch to a substrate and the evaporation material is vapor deposited on the substrate. Further, a longitudinal direction of an evaporation source holder in a rectangular shape may be oblique to one side of a substrate, while the evaporation source holder is being moved. Furthermore, it is preferable that a movement direction of an evaporation source holder during vapor deposition be different from a scanning direction of a laser beam while a TFT is formed.

Claims

1. A fabrication system comprising:

a load chamber;

a transport chamber connected with said load chamber;

a plurality of film formation chambers connected with said transport chamber; and

an installation chamber connected with each of said film formation chambers;

wherein each of said plurality of film formation chambers comprises;

alignment means for allowing positions of a mask and a substrate to be in registry with each other;

substrate holding means;

a plurality of evaporation source holders; and

means for moving said evaporation source holders;

wherein each of said evaporation source holders has containers, said containers being arranged in a longitudinal direction of each of said evaporation source holders, in each of said containers an evaporation material is contained, and means for heating said containers;

wherein said installation chamber comprises;

means for heating said containers previously; and

means for transporting said containers into said evaporation source holders in said film formation chamber;

wherein each of said plurality of film formation chambers connects with a first vacuum exhaust treatment chamber for allowing an inside of each of said film formation chambers to be in a vacuum state; and

wherein said installation chamber connects with a second vacuum exhaust treatment chamber for allowing an inside of said installation chamber to be in a vacuum state.

2. The vapor deposition system according to claim 1, wherein said substrate holding device overlaps a terminal region, a cut region, or an end portion of the substrate with a mask being sandwiched therebetween.

3. The fabrication system according to claim 1, wherein said substrate holding device and said mask are bonded or welded with each other.

4. The fabrication system according to claim 1, wherein said means for moving said evaporation source holders has a mechanism moving said evaporation source holders in an X-axis direction at a given pitch and, further, a Y-axis direction at another given pitch.

5. The fabrication system according to claim 1, wherein said containers are arranged at equal intervals in each of the evaporation source holder.

6. The fabrication system according to claim 1, wherein the evaporation sources holders is rectangular.

7. A fabrication system comprising:

a load chamber;

a transport chamber connected with said load chamber;

a plurality of film formation chambers connected with said transport chamber; and

an installation chamber connected with each of said film formation chambers;

wherein each of said plurality of film formation chambers comprises;

alignment means for allowing positions of a mask and a substrate to be in registry with each other;

an evaporation source holder; and

means for moving said evaporation source holder;

wherein each of said plurality of film formation chambers connects with a vacuum treatment chamber for allowing an inside of each of said film formation chambers to be in a vacuum state;

wherein said evaporation source holder has containers, said containers being arranged in a longitudinal direction of said evaporation source holder, in each of said containers an evaporation material is contained, and means for heating said containers; and

wherein said means for moving said evaporation source holder moves said evaporation source holder with a longitudinal direction thereof being set obliquely to a side of the substrate in an X direction or a Y direction of the substrate.

8. The fabrication system according to claim 7, wherein the evaporation source holder is rectangular.

9. A fabrication system comprising:

a load chamber;

a transport chamber connected with said load chamber;

a plurality of film formation chambers connected with said transport chamber; and

an installation chamber connected with each of said film formation chambers;

wherein each of said plurality of film formation chambers comprises;

alignment means for allowing positions of a mask and a substrate to be in registry with each other,

an evaporation source holder; and

means for moving said evaporation source holder;

wherein each of said plurality of film formation chambers connected with a vacuum exhaust treatment chamber for allowing an inside of each of said film formation chambers to be in a vacuum state;

wherein said evaporation source holder has containers, said containers being arranged in a longitudinal direction of said evaporation source holder, in each of containers an evaporation material is contained, and means for heating said containers; and

wherein a side of the substrate is set obliquely to a direction in which said evaporation source holder is moved.

10. The fabrication system according to claim 9, wherein the evaporation source holder is rectangular.

11. A manufacturing method for a light emitting device:

comprising the steps of;

forming a semiconductor film over a substrate having an insulating surface;

irradiating a laser beam on said semiconductor film in a scanning manner;

forming a TFT comprising said semiconductor film;

forming a first electrode connected with said TFT;

moving an evaporation source holder provided with a organic compound in a direction different from a scanning direction of said laser beam to form a film containing said organic compound over said first electrode; and

forming a second electrode over said film containing said organic compound.

12. The manufacturing method for a light emitting device according to claim 11, wherein the evaporation source holder is rectangular.

13. The manufacturing method for a light emitting device according to claim 11, wherein said laser is one of a continuously oscillating laser and a pulse oscillation laser, and said laser is one or more kinds of members selected from the group consisting of YAG laser, YVO₄ laser, YLF laser, YAlO₃ laser, Y₂O₃ laser, glass laser, ruby laser, alexandrite laser and Ti:

sapphire laser.

14. The manufacturing method for a light emitting device according to claim 11, wherein said laser is one of a continuously oscillating laser and a pulse oscillation laser, and said laser is one or more kinds of members selected from the group consisting of excimer laser, Ar laser and Kr laser.

15. A manufacturing method for a light emitting device comprising the steps of:

forming a semiconductor film over a substrate having an insulating surface;

irradiating a laser beam over said semiconductor film in a scanning manner;

forming a TFT comprising said semiconductor film;

forming a first electrode connected with said TFT;

moving an evaporation source holder provided with said organic compound in a direction different from a direction perpendicular to a scanning direction of said laser beam to form a film containing an organic compound over said first electrode; and

forming said second electrode over a film containing said organic compound.

16. The manufacturing method for a light emitting device according to claim 15, wherein the evaporation source holder is rectangular.

17. The manufacturing method for a light emitting device according to claim 15, wherein said laser is one of a continuously oscillating laser and a pulse oscillation laser, and said laser is one or more kinds of members selected from the group consisting of YAG laser, YVO₄ laser, YLF laser, YAlO₃ laser, Y₂O₃ laser, glass laser, ruby laser, alexandrite laser and Ti:

sapphire laser.

18. The manufacturing method for a light emitting device according to claim 15, wherein said laser is one of a continuously oscillating laser and a pulse oscillation laser, and said laser is one or more kinds of members selected from the group consisting of excimer laser, Ar laser and Kr laser.

19. A fabrication system comprising:

a load chamber;

a transport chamber connected with said load chamber;

a plurality of film formation chambers connected with said transport chamber; and

an installation chamber connected with each of said film formation chambers;

wherein each of said plurality of film formation chambers comprises;

a CCD camera and a stopper for allowing positions of a mask and a substrate to be in registry with each other;

a frame;

a plurality of evaporation source holders; and

a stage for moving said evaporation source holders;

wherein said each of evaporation source holders has containers, said containers being arranged in a longitudinal direction of each of said evaporation source holders, in each of said containers an evaporation material is contained, and a heater for heating said containers;

wherein said installation comprises;

a heater for heating said containers previously; and

a transporting robot for transporting said containers into said evaporation source holders in said film formation chamber;

wherein each of said plurality of film formation chambers connects with a first vacuum exhaust treatment chamber for allowing an inside of each of said film formation chambers to be in a vacuum state; and

wherein said installation chamber chambers connects with a second vacuum exhaust treatment chamber for allowing an inside of said installation chamber to be in a vacuum state.

20. The vapor deposition system according to claim 19, wherein said frame overlaps a terminal region, a cut region, or an end portion of the substrate with a mask being sandwiched therebetween.

21. The fabrication system according to claim 19, wherein said frame and said mask are bonded or welded with each other.

22. The fabrication system according to claim 19, wherein said stage has a mechanism moving said evaporation source holders in an X-axis direction at a given pitch and, further, a Y-axis direction at another given pitch.

23. The fabrication system according to claim 19, wherein said containers are arranged at equal intervals in each of said evaporation source holders.

24. The fabrication system according to claim 19, wherein the rectangular evaporation source holders are rectangular.

25. A fabrication system comprising:

a load chamber;

a transport chamber connected with said load chamber;

a plurality of film formation chambers connected with said transport chamber; and

an installation chamber connected with each of said film formation chambers;

wherein each of said plurality of film formation chambers comprises;

a CCD camera and a stopper for allowing positions of a mask and a substrate to be in registry with each other;

an evaporation source holder; and

a stage for moving said evaporation source holder;

wherein each of said plurality of film formation chambers connects with a vacuum treatment chamber for allowing an inside of each of said film formation chambers to be in a vacuum state;

wherein said evaporation source holder has containers, said containers being arranged in a longitudinal direction of said evaporation source holder, in each of said containers an evaporation material is contained, and a heater for heating said containers; and

wherein said stage moves an evaporation source holder with a longitudinal direction thereof being set obliquely to a side of the substrate in an X direction or a Y direction of the substrate.

26. The fabrication system according to claim 25, wherein the evaporation source holder is rectangular.

27. A fabrication system comprising:

a load chamber;

a transport chamber connected with said load chamber;

a plurality of film formation chambers connected with said transport chamber; and

an installation chamber connected with said film formation chambers;

wherein each of said plurality of film formation chambers comprises;

a CCD camera and a stopper for allowing positions of a mask and a substrate to be in registry with each other, an evaporation source holder; and

a stage for moving said evaporation source holder;

wherein each of said plurality of film formation chambers connects with a vacuum exhaust treatment chamber for allowing an inside of each of said film formation chambers to be in a vacuum state;

wherein said evaporation source holder has containers, said containers being arranged in a longitudinal direction of said evaporation source holder, in each of containers an evaporation material is contained, and a heater for heating said containers; and

wherein a side of the substrate is set obliquely to a direction in which said evaporation source holder is moved.

28. The fabrication system according to claim 27, wherein the evaporation source holder is rectangular.