LED package die having a small footprint
First Claim
Patent Images
1. A light emitting die package comprising:
- a stem substrate having a first end surface and a second end surface, said stem substrate defining at least one groove;
a wire lead running along the groove of said stem substrate, the wire lead terminating at the first end surface; and
a light emitting diode (LED) mounted on the first end surface, the LED making electrical and thermal contact with said stem substrate, the LED also connected to the wire lead.
3 Assignments
0 Petitions
Accused Products
Abstract
A light emitting die package and a method of making the light emitting die package are disclosed. The die package includes a stem substrate having grooves, a wire lead attached to the grooves, and a light emitting diode (LED) mounted on the stem substrate. Also coupled to the substrate are a sleeve, a reflector, and a lens. To make the light emitting die package, a long substrate is formed and wire leads attached to the substrate. Then, the substrate including the attached wire leads is cut to predetermine lengths to form individual stem substrates. To each stem substrate, LED, reflector, and lens are coupled.
-
Citations
26 Claims
-
1. A light emitting die package comprising:
-
a stem substrate having a first end surface and a second end surface, said stem substrate defining at least one groove;
a wire lead running along the groove of said stem substrate, the wire lead terminating at the first end surface; and
a light emitting diode (LED) mounted on the first end surface, the LED making electrical and thermal contact with said stem substrate, the LED also connected to the wire lead. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
-
-
16. A light emitting die package array comprising:
-
an array housing including an external heatsink and reflector bowl, said array housing defining die package spaces;
a plurality of light emitting die packages mounted in the die package spaces, each light emitting die comprising;
a stem substrate having a first end surf-ace and a second end surface, said stem substrate defining at least one groove;
a wire lead mounted on the groove of said stem substrate, the wire lead terminating at the first end surface; and
a light emitting diode (LED) mounted on the first end surface making electrical and thermal contact with said stem substrate, the LED also connected to the wire lead. - View Dependent Claims (17, 18, 19, 20, 21)
-
-
22. A method of manufacturing a light emitting die package, the method comprising:
-
fabricating a stem substrate rod having a predetermined length, the stem substrate rod defining at least one groove;
attaching wire lead on the groove of the stem substrate rod;
cutting the stem substrate rod including the attached wire leads to a predetermined length thereby forming an individual stem substrate;
planarizing a first end surface of the individual stem substrate; and
mounting a light emitting diode (LED) on the first end surface, the LED making electrical and thermal contact with the stem substrate, the LED also connected to the wire lead. - View Dependent Claims (23, 24, 25, 26)
-
Specification