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Semiconductor device package with leadframe-to-plastic lock

  • US 20040124505A1
  • Filed: 12/27/2002
  • Published: 07/01/2004
  • Est. Priority Date: 12/27/2002
  • Status: Abandoned Application
First Claim
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1. A method for manufacturing a packaged semiconductor device comprising the steps of:

  • forming a leadframe;

    forming at least one borehole in the leadframe;

    coining a leadframe portion having at least one borehole such that a lip is formed at the junction of the borehole and a leadframe surface; and

    encapsulating the lip with mold compound.

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