Semiconductor device package with leadframe-to-plastic lock

• US 20040124505A1
• Filed: 12/27/2002
• Published: 07/01/2004
• Est. Priority Date: 12/27/2002
• Status: Abandoned Application

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Simpson, Don L., Mahle, Richard L.
• Application Number:
  US10/331,669
• Publication Number:
  US 20040124505A1
• Time in Patent Office: Days
• US Class Current: 257/666
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/49548 Cross section geometry H01L23/49562 takes precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/207 Diameter ranges

Abstract

Methods for manufacturing a semiconductor device package (10) with a leadframe (14) to plastic (12) mold lock are disclosed along with the associated package (10). A method of the invention discloses manufacturing a packaged semiconductor device (10) using steps for forming a leadframe (14) with at least one borehole (20). The borehole (20) region of the leadframe (14) is coined such that a lip (34) is formed at the junction of the borehole (20) and a leadframe (14) surface. Encapsulating the lip (34) with mold compound (12) forms a leadframe (14) to plastic (12) lock incorporated in the completed semiconductor device package (10).

Claims

1. A method for manufacturing a packaged semiconductor device comprising the steps of:

forming a leadframe;

forming at least one borehole in the leadframe;

coining a leadframe portion having at least one borehole such that a lip is formed at the junction of the borehole and a leadframe surface; and

encapsulating the lip with mold compound.

2. The method of claim 1 wherein the step of forming at least one borehole further comprises perforating through the leadframe.

3. The method of claim 2 wherein the step of coining further comprises forming a lip at each junction of the borehole and upper and lower leadframe surfaces.

4. The method of claim 1 further comprising a step of downsetting an area of the leadframe.

5. The method of claim 4 further comprising a step of downsefting a die pad of the leadframe.

6. The method of claim 4 wherein the downsetting step is performed in combination with the coining step.

7. A method for manufacturing a semiconductor device package comprising the steps of:

forming a leadframe having a die pad and a plurality of lead fingers;

forming a plurality of boreholes in the leadframe, at least one of the boreholes having a lip; and

encapsulating the lip forming a mold lock for the semiconductor device package.

8. The method of claim 7 wherein the step of forming at least one borehole further comprises perforating through the leadframe.

9. The method of claim 7 further comprising the step of coining a leadframe portion having at least one borehole thereby forming a lip at a junction of the borehole and a surface of the leadframe.

10. The method of claim 7 further comprising a step of downsetting a portion of the leadframe.

11. The method of claim 7 further comprising a step of downsetting a die pad of the leadframe.

12. The method of claim 10 wherein the downsetting step is performed in combination with the coining step.

13. The method of claim 7 wherein at least one borehole having a lip is formed in a lead finger of the leadframe.

14. The method of claim 7 wherein at least one borehole having a lip is disposed in a die pad of the leadframe.

15. A semiconductor device package comprising:

a leadframe having a borehole, the borehole having a lip; and

mold compound disposed in the borehole and encapsulating the lip.

16. A semiconductor device package according to claim 15 wherein the borehole further comprises a perforation through the leadframe.

17. A semiconductor device package according to claim 16 further comprising a lip at each junction of the borehole and upper and lower leadframe surfaces.

18. A semiconductor device package according to claim 15 wherein at least one borehole is disposed in a lead finger of the leadframe.

19. A semiconductor device package according to claim 15 wherein at least one borehole is disposed in a die pad of the leadframe.

20. A semiconductor device package according to claim 15 wherein the mold compound fills the borehole.