Method and apparatus for supplying power to a semiconductor device using a capacitor DC shunt
First Claim
1. A semiconductor device comprising:
- a motherboard having first and second type conductive portions embedded therein coupled to a power source;
a socket portion defined on and projecting above an upper surface of the motherboard and electrically coupled to the first and second type conductive portions;
a package coupled to the motherboard via the socket portion, said package having a suspended portion between the sockets wherein an underside of the suspended portion is spaced from an opposing upper surface portion of the motherboard;
package conductors within the package adapted to transmit current from a bottom surface to a top surface of the package;
a die load affixed to a top surface of the package above the suspended portion and electrically coupled via the package conductors through the socket portion to the first and second type conductive portions to provide a first power source path for the die load; and
a capacitor located within the space between the suspended portion of the package and the opposing upper surface portion of the motherboard, said capacitor being electrically coupled between the first and second type conductive portions within the motherboard and the package conductors to provide a second power source path for the die load.
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Accused Products
Abstract
A power shunt for use within a semiconductor device of a type having a motherboard and an integrated circuit package electrically coupled to the motherboard and of a type having a spaced portion located between the motherboard and the package. The power shunt comprises a capacitor within the spaced portion between the motherboard and the package of the semiconductor device. The capacitor includes a conductive layer of a first type, a conductive layer of a second type, and a dielectric layer that electrically isolates the first type conductive layer from the second type conductive layer, wherein said first type conductive layer and second type conductive layer form a conductive bridge between the motherboard and the package. The arrangement of the capacitor fulfills the dual function of providing decoupling capacitance with the capability of supplying an additional path of current between the motherboard and package to the die load 16.
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Citations
20 Claims
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1. A semiconductor device comprising:
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a motherboard having first and second type conductive portions embedded therein coupled to a power source;
a socket portion defined on and projecting above an upper surface of the motherboard and electrically coupled to the first and second type conductive portions;
a package coupled to the motherboard via the socket portion, said package having a suspended portion between the sockets wherein an underside of the suspended portion is spaced from an opposing upper surface portion of the motherboard;
package conductors within the package adapted to transmit current from a bottom surface to a top surface of the package;
a die load affixed to a top surface of the package above the suspended portion and electrically coupled via the package conductors through the socket portion to the first and second type conductive portions to provide a first power source path for the die load; and
a capacitor located within the space between the suspended portion of the package and the opposing upper surface portion of the motherboard, said capacitor being electrically coupled between the first and second type conductive portions within the motherboard and the package conductors to provide a second power source path for the die load. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A power shunt for use within a semiconductor device of a type having a motherboard and an integrated circuit package electrically coupled to the motherboard, said device further of a type having a spaced portion located between the motherboard and the package, the power shunt comprising:
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a capacitor adapted to be positioned within the spaced portion between the motherboard and the package of the semiconductor device, said capacitor having a conductive layer of a first type, a conductive layer of a second type, and a dielectric layer that electrically isolates the first type conductive layer from the second type conductive layer, wherein said first type conductive layer and second type conductive layer are adapted to form a conductive bridge between the motherboard and the package. - View Dependent Claims (11, 12, 13, 14)
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15. A method for coupling a capacitor between an integrated circuit package and a motherboard having a die load disposed thereon, the method comprising:
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electrically connecting a first source of capacitance to an underside of the package, wherein the first source of capacitance includes a first conductive layer, a second conductive layer, and a dielectric layer that electrically isolates the first conductive layer from the second conductive layer; and
electrically connecting the first conductive layer of the first source of capacitance and the second conductive layer to the motherboard so that the first and second conductive layers form a conductive bridge between the motherboard and the package. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification