Thermal interface material
First Claim
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1. A thermal interface material comprising:
- a polymer matrix having a thermally conductive first face and an opposite thermally conductive second face; and
a plurality of carbon nanocapsules incorporated in the polymer matrix.
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Abstract
A thermal interface material (40) includes a polymer matrix and a number of carbon nanocapsules incorporated in the polymer matrix. The thermal interface material is sandwiched between a heat source (30) having a high density and a heat sink (50). The thermal interface material can provide a maximum surface contact area and can increase thermal conductivity between the heat source and the heat sink.
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Citations
19 Claims
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1. A thermal interface material comprising:
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a polymer matrix having a thermally conductive first face and an opposite thermally conductive second face; and
a plurality of carbon nanocapsules incorporated in the polymer matrix. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An electronic assembly comprising:
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a heat resource defining a first plane;
a heat sink defining a second plane immediately opposite to and parallel to said first plane;
a thermal interface material sealing a gap between said first and second planes;
wherein said thermal interface material is essentially composed of a plurality of carbon nanocapsules embedded within a solid polymer matrix. - View Dependent Claims (13, 14, 15, 16, 17)
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18. A method of making an electrical assembly comprising:
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providing a first plane obtaining heat from a heat source;
providing a second plane oppositely parallel to said first plane for transferring said heat to a heat sink; and
providing a thermal interface material sealing a gap between said first and second planes for transferring said heat from the first plane to the second plane;
whereinsaid thermal interface material comprises a plurality of carbon nanocapsules embedded in a solid while resiliently compressed material layer. - View Dependent Claims (19)
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Specification