Composite leadframe LED package and method of making the same
First Claim
1. A light emitting die package comprising:
- a leadframe including a plurality of leads, said leadframe having top side and bottom side, and a portion of said leadframe defining a mounting pad;
a bottom heatsink coupled to the bottom side of said leadframe; and
a top heatsink coupled to the top side of said leadframe, said top heatsink defining an opening, the opening generally surrounding the mounting pad.
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Accused Products
Abstract
Light emitting die package is disclosed. The die package includes a leadframe, a bottom heatsink, a top heatsink, a reflector and a lens. The top and bottom heatsinks are thermally coupled but electrically insulated from the leadframe. The leadframe includes a plurality of leads and defines a mounting pad for mounting LEDS. The top heatsink defines an opening over the mounting pad. The reflector is coupled to the top heatsink at the opening. The lens is placed over the opening defining an enclosed cavity over the mounting pad. At least one light emitting device (LED) is mounted on the mounting pad within the cavity. Encapsulant optically couples the LED to its surrounding surfaces to maximize its optical performance. When energized, the LED generates light and heat. The light is reflected by the reflector and operated on by the lens. The heat is dissipated by the top and the bottom heatsinks.
240 Citations
23 Claims
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1. A light emitting die package comprising:
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a leadframe including a plurality of leads, said leadframe having top side and bottom side, and a portion of said leadframe defining a mounting pad;
a bottom heatsink coupled to the bottom side of said leadframe; and
a top heatsink coupled to the top side of said leadframe, said top heatsink defining an opening, the opening generally surrounding the mounting pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A light emitting die package comprising:
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a leadframe including a plurality of leads, said leadframe having top side and a bottom side, and a portion of said leadframe defining a mounting pad;
a bottom heatsink thermally coupled to the bottom side of said leadframe under the mounting pad, said bottom heatsink electrically insulated from said leadframe;
a top heatsink thermally coupled to the top side of said leadframe, said top heatsink defining an opening, the opening generally surrounding the mounting pad, said top heatsink electrically insulated from said leadframe, and said top heatsink coupled to a reflector also surround the mounting pad;
at least one light emitting device (LED) mounted on the mounting pad, the LED adapted to generate light when energized; and
a lens coupled to said top heatsink over the opening, said lens adapted to operate on the light generated by the LED, the lens, covering the opening thereby defining an enclosed cavity. - View Dependent Claims (11, 12, 13)
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14. A method of manufacturing a light emitting die package, the method comprising:
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fabricating a leadframe die, the leadframe die including a plurality of leads and die frame, each lead and the die frame having a top side and a bottom side;
coupling a top heatsink over the leadframe die, the top heatsink defining an opening;
coupling a bottom heatsink under the leadframe die; and
stamping the leadframe die to cut-away the die frame. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23)
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Specification