Chip on board and heat sink attachment methods
First Claim
1. An assembly method for a Chip On Board semiconductor device having a semiconductor die having a heat sink cap abutting a portion of the top surface of a substrate including:
- placing a compliant adhesive filled gel silicone elastomer between a portion of an upper surface of said semiconductor die and a portion of a lower surface of said heat sink cap;
pressing said semiconductor die into said cap to engage said die and cap in compliant removable adhesion and for the edge of the cap to abut the substrate; and
injecting an encapsulant into said heat sink cap engaging at least interior portions of said heat sink cap, at least portions of said semiconductor die, at least portions of an upper surface of said substrate, and at least portions of said filled gel silicone elastomer.
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0 Petitions
Accused Products
Abstract
A process for forming a thermally enhanced Chip On Board semiconductor device (10) with a heat sink (30) is described. In one aspect, a thermally conducting filled gel elastomer material (50) or a silicon elastomeric material or elastomeric material, if the material is to be removed, is applied to the die surface (18) to which the heat sink is to be bonded. During the subsequent glob top application and curing steps, difficult-to-remove glob top material (38) which otherwise may be misapplied to the die surface adheres to the upper surface of the elastomer material. The elastomer material is removed by peeling prior to adhesion bonding of the heat sink to the die.
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Citations
4 Claims
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1. An assembly method for a Chip On Board semiconductor device having a semiconductor die having a heat sink cap abutting a portion of the top surface of a substrate including:
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placing a compliant adhesive filled gel silicone elastomer between a portion of an upper surface of said semiconductor die and a portion of a lower surface of said heat sink cap;
pressing said semiconductor die into said cap to engage said die and cap in compliant removable adhesion and for the edge of the cap to abut the substrate; and
injecting an encapsulant into said heat sink cap engaging at least interior portions of said heat sink cap, at least portions of said semiconductor die, at least portions of an upper surface of said substrate, and at least portions of said filled gel silicone elastomer. - View Dependent Claims (2)
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3. An assembly method for a Chip On Board semiconductor device having a semiconductor die contained within a portion of a cap having a lower edge abutting a portion of a top surface of a substrate comprising:
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positioning a compliant adhesive filled gel silicone elastomer between said semiconductor die and said cap;
pressing said semiconductor die into said cap causing removable adhesion of said semiconductor die and said cap and causing the lower edge of said cap to abut said substrate; and
injecting an encapsulant into said cap engaging at least interior portions of said cap, at least portions of said semiconductor die, at least portions of an upper surface of said substrate, and at least portions of said filled gel silicone elastomer. - View Dependent Claims (4)
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Specification