Maskless lithography with multiplexed spatial light modulators

• US 20040130561A1
• Filed: 01/07/2003
• Published: 07/08/2004
• Est. Priority Date: 01/07/2003
• Status: Active Grant

• Current Assignee: Anvik Corporation
• Original Assignee: Anvik Corporation
• Inventors: Jain, Kanti
• Granted Patent: US 6,870,554 B2
• Time in Patent Office: Days
• US Class Current: 345/694
• CPC Class Codes: G03F 7/70283 Mask effects on the imaging process
• CPC Class Codes: G03F 7/70291 Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices

Abstract

Imaging systems that use a spatial light modulator (SLM), such as maskless lithography systems using a digital micromirror device (DMD), suffer from low throughput at high resolution because of the increase in the number of pixels to be imaged. A possible solution to this problem is provided by using multiple SLMs. However, packaging multiple SLMs on a suitable base is inefficient because, in an SLM, surrounding the active region, a large inactive region is required for the chip kerf and the connector fan-in; these inactive regions thus prevent close packing of the SLMs. This invention enables close packing of a large number of SLMs by arranging them in twin planes, such that the kerf and fan-in regions overlap substantially. Variations in the optical conjugate distances of different SLMs caused by the twin planarity are eliminated by incorporation of a twin-pane compensating mirror array that corresponds to the SLM array, and introduces a pathlength difference between different mirrors that is complementary to the pathlength difference between corresponding SLM chips. Depth-of-focus problems are thus eliminated. The invention enables significant throughput enhancement, up to 82%, in maskless lithography systems.

Claims

1. An imaging system for providing selected myriad-pixel patterns on substrate surfaces requiring high-resolution exposure to light within limited depth-of-focus tolerance, using a plurality of reflective spatial light modulator (RSLM) chips each having an active micromodulator array area for beam transfer and a kerf area usable for addressing individual micromodulators

characterized by:

a) a light source (1-4) of a conditioned pulsed light beam of significant area;

b) a plural-plane multiplexed reflective spatial light modulator (RSLM) package (5) having a plurality of RSLM myriad-pixel chips (5-1 . . . 5-n) mounted with partial overlap in an alternating-plane pattern presenting a plurality of planar micromodulator pixel mirror surfaces including at least first and second pixel micromodulator planes;

c) means for mounting said plural-plane multiplexed reflective spatial light modulator package (5) to receive the conditioned pulsed light beam from said light source (1-4) and provide selected pixel beamlets as selected by the system;

d) a plural-plane compensator mirror package (6), having mirror areas (6-1 . . . 6-n) mounted in an alternating-plane pattern presenting a plurality of planar mirror surfaces including at least first and second mirror planes complementary to said first and second pixel micromodulator planes of said multiplexed reflective spatial light modulator package (5);

e) projection scanning means (7-11) for presenting a substrate for imaging according to beamlet selection; and

f) means for mounting said plural-plane multiplexed mirror package (6) to forward the selected conditioned pulsed light beamlets from said multiplex spatial light modulator package (5) via said projection scanning means (7-11) for imaging said substrate according to beamlet selection;

whereby the individual pixel beamlets from all micromodulator chips in the multiplexed RSLM package are maintained within near-constant beamlet lengths to maintain depth-of-focus tolerance at the entry plane of said projection scanning means, and whereby the micromodulator chips in the multiplexed reflective SLM package are efficiently utilized for imaging to provide enhanced-throughput patterning of said substrate.

2. An imaging system according to claim 1, wherein said RSLM package comprises chips of digital micromirror devices (DMDs).

3. An imaging system according to claim 1, wherein said RSLM package comprises chips of reflective liquid crystal devices.

4. An imaging system according to claim 2, wherein said plural-plane multiplexed DMD chip package (5) and said plural-plane multiplexed compensating mirror package (6) have reflecting surfaces in two parallel planes each.

5. An RSLM package array for use in large-area imaging, with RSLM chip packages having micromodulator areas and surrounding kerf areas on-chip, and also having associated surrounding off-chip fan-in circuit-board areas,

characterized by:

a) a base;

b) a first plurality of RSLM packages mounted with selected spacing at a first level on said base; and

c) a second plurality of RSLM packages mounted on said base at a higher level, with vertical spacing and horizontal spacing for substantial overlap of kerf areas and fan-in areas but without micromodulator area overlap.

6. An RSLM package mirror compensator package for use in imaging in which RSLM chips are in plural planes having micromodulator areas and substantially overlapping surrounding areas, creating variations in micromodulator pixel beamlet lengths

characterized by:

a) a base;

b) a first plurality of mirrors mounted with selected spacing at a first level on said base; and

c) a second plurality of mirrors mounted on said base at a higher level on said base,

said mirrors having vertical spacing and horizontal spacing appropriate for complementing the pixel beamlet length variations caused by different micromodulator chips of the RSLM package.