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Probe card for semiconductor wafers and method and system for testing wafers

  • US 20040132222A1
  • Filed: 12/19/2003
  • Published: 07/08/2004
  • Est. Priority Date: 02/11/1997
  • Status: Active Grant
First Claim
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1. A probe card for testing a semiconductor wafer comprising:

  • a substrate comprising a contact member and a first conductor formed on the substrate in electrical communication with the contact member; and

    a membrane for physically and electrically attaching the substrate to a test fixture, said membrane comprising tape with a second conductor thereon electrically attached to the first conductor.

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