Electronic device packaging and curable resin composition

• US 20040132888A1
• Filed: 12/16/2003
• Published: 07/08/2004
• Est. Priority Date: 12/16/2002
• Status: Abandoned Application

• Current Assignee: UBE Industries Limited
• Original Assignee: UBE Industries Limited
• Inventors: Naiki, Masahiro, Tanaka, Yoshiki, Ishikawa, Seiji, Matsui, Yuji, Kinouchi, Masayuki
• Application Number:
  US10/735,708
• Publication Number:
  US 20040132888A1
• Time in Patent Office: Days
• US Class Current: 524/449
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/296 Organo-silicon compounds
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 2201/0162 Silicon containing polymer, e.g. silicone
• CPC Class Codes: H05K 3/285 Permanent coating compositions
• CPC Class Codes: H05K 3/3452 Solder masks
• CPC Class Codes: Y10T 29/49171 with encapsulating
• CPC Class Codes: Y10T 29/49224 with coating

Abstract

A process for packaging an electronic device employs an insulating protective resin layer produced from one or more of the resin compositions: (1) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.5 to 30 parts of an epoxy compound having an epoxy equivalent of more than 800, and an organic solvent; (2) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 10 parts of an epoxy compound having an epoxy equivalent of 100 to 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent; and (3) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 20 parts of an epoxy compound having an epoxy equivalent of more than 800, 2 to 30 parts of a polyvalent isocyanate compound, and an organic solvent.

Claims

1. In a process for packaging an electronic device comprising the steps of:

preparing a printed wiring board which has wiring copper layers coated with a metal layer comprising a metal other than copper;

coating the metal layer with an insulating protective resin layer, keeping an area for mounting an electronic device exposed;

mounting the electronic device on the exposed area via an electroconductive material; and

coating the mounted electronic device and a portion of the insulating protective resin layer with an encapsulant;

an improvement in which the insulating protective resin layer is produced by employing at least one of the following resin compositions (1) to (3);

(1) a resin composition comprising 100 weight parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.5 to 30 weight parts of an epoxy compound having an epoxy equivalent of more than 800, and an organic solvent;

(2) a resin composition comprising 100 weight parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 10 weight parts of an epoxy compound having an epoxy equivalent of 100 to 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent; and

(3) a resin composition comprising 100 weight parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 20 weight parts of an epoxy compound having an epoxy equivalent of more than 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent.

2. The process of claim 1, wherein the metal layer comprises tin.

3. The process of claim 1, wherein the organic solvent-soluble resin is an organic solvent-soluble polyimide-siloxane.

4. The process of claim 3, wherein the organic solvent-soluble polyimide siloxane is produced by a reaction of a tetracarboxylic acid compound with a diamine compound comprising 30 to 95 mol. % of a diaminopolysiloxane compound, 0.5 to 40 mol. % of an aromatic diamine compound having a polar group on an aromatic ring thereof and 0 to 69.5 mol. % of an diamine compound other than the aromatic diamine compound.

5. The process of claim 1, wherein the resin composition contains a curing catalyst.

6. The process of claim 1, wherein the resin composition contains a filler.

7. The process of claim 1, wherein the resin composition is curable at a temperature of lower than 130°

C.

8. A resin composition comprising a combination of 100 weight parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 10 weight parts of an epoxy compound having an epoxy equivalent of 100 to 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent, or a combination of 100 weight parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 20 weight parts of an epoxy compound having an epoxy equivalent of more than 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent.

9. The resin composition of claim 8, wherein the organic solvent-soluble resin is an organic solvent-soluble polyimide-siloxane.

10. The resin composition of claim 9, wherein the organic solvent-soluble polyimide siloxane is produced by a reaction of a tetracarboxylic acid compound with a diamine compound comprising 30 to 95 mol. % of a diaminopolysiloxane compound, 0.5 to 40 mol. % of an aromatic diamine compound having a polar group on an aromatic ring thereof and 0 to 69.5 mol. % of an diamine compound other than the aromatic diamine compound.

11. The resin composition of claim 8, which further contains a curing catalyst.

12. The resin composition of claim 8, which further contains a filler.

13. The resin composition of claim 8, which is curable at a temperature of lower than 130°

C.

14. A cured resin material which is produced by curing at least one of the following resin compositions (1) to (3) for producing:

(1) a resin composition comprising 100 weight parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.5 to 30 weight parts of an epoxy compound having an epoxy equivalent of more than 800, and an organic solvent;

(2) a resin composition comprising 100 weight parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 10 weight parts of an epoxy compound having an epoxy equivalent of 100 to 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent; and

(3) a resin composition comprising 100 weight parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 20 weight parts of an epoxy compound having an epoxy equivalent of more than 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent,

and which shows no glass transition temperature of higher than 160°

C.

15. The cured resin material of claim 14, wherein the organic solvent-soluble resin is an organic solvent-soluble polyimide-siloxane.

16. The cured resin material of claim 15, wherein the organic solvent-soluble polyimide siloxane is produced by a reaction of a tetracarboxylic acid compound with a diamine compound comprising 30 to 95 mol. % of a diaminopolysiloxane compound, 0.5 to 40 mol. % of an aromatic diamine compound having a polar group on an aromatic ring thereof and 0 to 69.5 mol. % of an diamine compound other than the aromatic diamine compound.

17. The cured resin material of claim 14, which further contains a curing catalyst.

18. The cured resin material of claim 14, which further contains a filler.