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Ionic plasma deposition apparatus

  • US 20040134770A1
  • Filed: 10/30/2003
  • Published: 07/15/2004
  • Est. Priority Date: 11/15/2002
  • Status: Abandoned Application
First Claim
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1. A plasma deposition apparatus for applying one or more thin film materials into or onto a substrate by selectively controlling the depositing plasma constituents that will reach a substrate from a cathode, the apparatus comprising:

  • (a) a vacuum chamber, (b) a cathode disposed within said vacuum chamber comprised of a target material, said cathode being powered to generate an electric arc to create said plasma of constituent particles;

    (c) at least one first anode disposed within said vacuum chamber for generating an electromagnetic field between said cathode said first anode to guide the flow of charged constituent particles;

    (d) at least one second anode structure positioned adjacent to said first anode, said second anode generating an electromagnetic field to direct said charged constituent particles to the substrate for deposition;

    (e) at least one wall and screen positioned adjacent to said second anode to control flow of neutral constituent particles to the substrate.

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