Substrate for mounting a semiconductor chip
First Claim
1. A substrate comprising a non-electrically conducting material for mounting a semiconductor chip, the substrate comprising a semiconductor chip mounting portion, a number of first electrically conducting contact portions formed on the surface of the material and associated with the mounting portion, a second electrically conducting contact portion formed on the surface of the material, the second electrically conducting contact portion being adapted to be coupled to testing equipment, and a number of electrically conducting paths formed on the surface of the material, the conducting paths electrically connecting the second electrically conducting contact portion to a minority of the first electrically conducting contact portions.
1 Assignment
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Accused Products
Abstract
A substrate (1) is formed from a non-electrically conducting material and is for mounting a semiconductor chip (10). The substrate has a semiconductor chip mounting portion (6). A number of first electrically conducting contact portions (5) are formed on the surface of the material and associated with the mounting portion (6). A second electrically conducting contact portion (3) is formed on the surface of the material, and the second electrically conducting contact portion (3) is adapted to be coupled to testing equipment. A number of electrically conducting paths (4) are formed on the surface of the material. The conducting paths (4) electrically connect the second electrically conducting contact portion (3) to a minority of the first electrically conducting contact portions (5).
10 Citations
9 Claims
- 1. A substrate comprising a non-electrically conducting material for mounting a semiconductor chip, the substrate comprising a semiconductor chip mounting portion, a number of first electrically conducting contact portions formed on the surface of the material and associated with the mounting portion, a second electrically conducting contact portion formed on the surface of the material, the second electrically conducting contact portion being adapted to be coupled to testing equipment, and a number of electrically conducting paths formed on the surface of the material, the conducting paths electrically connecting the second electrically conducting contact portion to a minority of the first electrically conducting contact portions.
Specification