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Interface for UV-curable adhesives

  • US 20040135268A1
  • Filed: 01/14/2003
  • Published: 07/15/2004
  • Est. Priority Date: 01/14/2003
  • Status: Active Grant
First Claim
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1. An encapsulated organic electronic device, comprising:

  • a substrate;

    an organic electronic device on said substrate;

    an ultraviolet (“

    UV”

    )-curable adhesive on said substrate, said UV-curable adhesive surrounds a perimeter of said organic electronic device;

    an adhesion layer on said UV-curable adhesive; and

    an encapsulation lid on said adhesion layer, said encapsulation lid is nonopaque, wherein said adhesion layer is comprised of a metallic layer or a ceramic layer that is thin enough to be nonopaque and thick enough to provide stronger adhesion at an interface with said UV-curable adhesive than said encapsulation lid.

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