Camera case structure for a mobile communication device

• US 20040135920A1
• Filed: 12/23/2003
• Published: 07/15/2004
• Est. Priority Date: 12/30/2002
• Status: Active Grant

• Current Assignee: LG Electronics, Inc. (LG Corporation)
• Original Assignee: LG Electronics, Inc. (LG Corporation)
• Inventors: Choo, Zhi Min
• Granted Patent: US 7,324,155 B2
• Time in Patent Office: Days
• US Class Current: 348/340
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H04N 23/51 Housings
• CPC Class Codes: H05K 1/0271 Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion

Abstract

A support structure for reducing shock to a camera module for use in a mobile communications terminal is provided. The mobile communication terminal comprises a camera case for housing the camera module, the support structure comprising a first projection protruding from an inner surface of the camera case, the first projection in operational relationship with a first receiving cavity formed in the camera module to firmly hold the camera module inside the camera case and prevent the camera module from moving in relationship to the camera case.

Claims

1. A support structure for reducing shock to a camera module for use in a mobile communications terminal, wherein the mobile communication terminal comprises a camera case for housing the camera module, the support structure comprising:

a first projection protruding from an inner surface of the camera case, the first projection in operational relationship with a first receiving cavity formed in the camera module to firmly hold the camera module inside the camera case and prevent the camera module from moving in relationship to the camera case.

2. The support structure of claim 1, further comprising:

a second projection protruding from the inner surface of the camera case, the second projection in operational relationship with a second receiving cavity formed in the camera module to firmly hold the camera module inside the camera case and prevent the camera module from moving in relationship to the camera case.

3. The support structure of claim 2, wherein the camera module comprises a lens positioned proximate to the first receiving cavity.

4. The support structure of claim 3, wherein the camera module comprises a printed circuit board positioned proximate to the second receiving cavity.

5. The support structure of claim 4, wherein the first projection engages the first receiving cavity in an upper portion of the camera module.

6. The support structure of claim 5, wherein the second projection engages the second receiving cavity in a lower portion of the camera module.

7. A camera case for receiving outer surface of a camera module having an upper portion and a lower portion, the cameral case comprising:

first inward projections for firmly engaging concaved areas of the upper portion of the camera module to prevent sensitive areas of the camera module from shock.

8. The camera case of claim 7, further comprising:

second inward projections for firmly engaging indented areas of the lower portion of the camera module to prevent sensitive areas of the camera module from shock.

9. The camera case of claim 8, wherein the sensitive areas of the camera comprise a printed circuit board.

10. The camera case of claim 8, wherein a lens is constructed in proximity of the upper portion and a printed circuit board is constructed in proximity to the lower portion of the camera module.