Vibration-attenuation devices and methods using pressurized bellows exhibiting substantially zero lateral stiffness
First Claim
1. A device for placement between a first mass and a second mass for attenuating transmission of lateral vibration from one of the masses to the other of the masses, the device comprising at least one bellows situated along a respective support axis between the first and second masses and configured to be pressurized with a fluid, the bellows defining an interior volume that is pressurized to an internal fluid pressure substantially equal to a zero-stiffness pressure such that the bellows exhibits a substantially zero lateral stiffness.
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Abstract
Vibration-attenuation devices and methods are disclosed that utilize a bellows situated between a first and second mass and pressurized with a fluid to an internal fluid pressure substantially equal to a zero-stiffness pressure such that the bellows exhibits a substantially zero lateral stiffness. The devices may include various components configured to measure, regulate, and control the internal pressure of the bellows in order to maintain a desired pressure. The devices may include an active support, such as a secondary bellows or linear actuator, that provides a secondary support force. The active support may be connected to various components configured to measure and control the secondary support force. The vibration-attenuation devices disclosed may be used in a lithography exposure apparatus to attenuate vibrations between: (1) a support frame and a support surface; (2) a base and a stage-supporting platform; and (3) a supporting stage and a wafer stage.
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Citations
111 Claims
- 1. A device for placement between a first mass and a second mass for attenuating transmission of lateral vibration from one of the masses to the other of the masses, the device comprising at least one bellows situated along a respective support axis between the first and second masses and configured to be pressurized with a fluid, the bellows defining an interior volume that is pressurized to an internal fluid pressure substantially equal to a zero-stiffness pressure such that the bellows exhibits a substantially zero lateral stiffness.
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25. A lithographic exposure apparatus, comprising:
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a support frame for supporting the lithographic exposure apparatus relative to a support surface; and
at least one vibration-attenuation device situated between the support frame and the support surface, the vibration-attenuation device comprising a bellows defining an interior volume configured to be pressurized with a fluid, the bellows being situated along a respective support axis of the support frame and positioned between the support frame and the support surface, wherein the interior volume of the bellows is pressurized to an internal fluid pressure substantially equal to a zero-stiffness pressure such that the bellows exhibits a substantially zero lateral stiffness. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 108)
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49. An apparatus for supporting a stage in a lithography system comprising:
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a base;
a platform on which a movable stage is configured to operate; and
at least one vibration-attenuation device situated between the platform and the base, the vibration-attenuation device comprising a bellows defining an interior volume configured to be pressurized with a fluid, the bellows being situated along a respective support axis of the platform and positioned between the platform and the base, wherein the interior volume of the bellows is pressurized to an internal fluid pressure substantially equal to a zero-stiffness pressure such that the bellows exhibits a substantially zero lateral stiffness. - View Dependent Claims (50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 109)
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75. A lithography system, comprising an apparatus for attenuating transmission of a vibration to and from a wafer stage in the lithography system, the apparatus comprising:
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a frame;
a wafer stage;
a supporting stage mounted to the frame; and
a vibration-attenuation device situated between the wafer stage and the supporting stage, the vibration-attenuation device comprising a bellows defining an interior volume configured to be pressurized with a fluid, the bellows being situated along a respective support axis of the wafer stage and positioned between the wafer stage and the supporting stage, wherein the interior volume of the bellows is pressurized to an internal fluid pressure substantially equal to a zero-stiffness pressure such that the bellows exhibits a substantially zero lateral stiffness. - View Dependent Claims (76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99, 100, 101, 110)
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102. A method for attenuating vibration between a first mass and a second mass, comprising:
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extending a bellows having an interior volume configured to be pressurized with a fluid between the first and second mass such that the second mass is supported, at least partially, by the bellows;
pressurizing the interior volume to a pressure substantially equal to a zero-stiffness pressure such that the bellows exhibits a substantially zero lateral stiffness. - View Dependent Claims (103, 104, 105, 106, 107, 111)
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Specification