Systems and methods for providing a dynamically modular processing unit
First Claim
1. A dynamically modular processing unit comprising:
- a first non-peripheral based encasement;
a first processor coupled to a first optimized circuit board that includes a first bus system, wherein the first optimized circuit board is coupled to the first non-peripheral based encasement; and
a first dynamic back plane coupled to the first non-peripheral based encasement, wherein the first dynamic back plane provides flexibility and support to peripherals and applications.
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Abstract
Systems and methods for providing a dynamically modular processing unit. A modular processing unit is provided as a platform that is lightweight, compact, and is configured to be selectively used alone or oriented with one or more additional processing units in an enterprise. In some implementations, a modular processing unit includes a non-peripheral based encasement, a cooling process (e.g., a thermodynamic convection cooling process, a forced air cooling process, and/or a liquid cooling process), an optimized circuit board configuration, optimized processing and memory ratios, and a dynamic back plane that provides increased flexibility and support to peripherals and applications. The modular processing unit is customizable and may be employed in association with all types of computer enterprises. The platform allows for a plethora of modifications that may be made with minimal impact to the dynamically modular unit, thereby enhancing the usefulness of the platform across all type of application.
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Citations
30 Claims
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1. A dynamically modular processing unit comprising:
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a first non-peripheral based encasement;
a first processor coupled to a first optimized circuit board that includes a first bus system, wherein the first optimized circuit board is coupled to the first non-peripheral based encasement; and
a first dynamic back plane coupled to the first non-peripheral based encasement, wherein the first dynamic back plane provides flexibility and support to peripherals and applications. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method for dynamically scaling processing power of a computer enterprise, the method comprising:
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providing a first modular processing unit having a first bus system;
providing a second modular processing unit having a second bus system, wherein the first and second modular processing units each include a non-peripherals-based encasement comprising;
a primary body chassis for providing main support to the encasement;
one or more plates removably coupled to the primary body chassis for enclosing the encasement and providing access to an interior portion of the encasement;
one or more processing components removably coupled to the encasement; and
means for dissipating thermal discharge from the encasement and to the surrounding ambient air, the thermal discharge generated by the processing components; and
coupling the first modular processing unit to the second modular processing unit to produce scaled processing power. - View Dependent Claims (22, 23, 24, 25)
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26. A modular processing system comprising:
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a first non-peripheral based encasement having first, second and third side wall supports and first and second end plates removably coupled to the first non-peripheral based encasement and comprising a plurality of ventilation ports;
a first processor coupled to a first optimized circuit board that includes a first bus system, wherein the first optimized circuit board is coupled to the first non-peripheral based encasement, wherein the first optimized circuit board is a tri-board electrical printed circuit board configuration removably secured within the encasement; and
a first interchangeable back plane coupled to the first non-peripheral based encasement, wherein the first dynamic back plane provides flexibility and support to peripherals and applications. - View Dependent Claims (27, 28, 29, 30)
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Specification