Device and method for electroless plating

• US 20040137161A1
• Filed: 03/08/2004
• Published: 07/15/2004
• Est. Priority Date: 04/06/2001
• Status: Abandoned Application

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Nogami, Takeshi, Segawa, Yuji, Ishihara, Masao, Yasuda, Zenya, Sato, Shuzo
• Application Number:
  US10/474,020
• Publication Number:
  US 20040137161A1
• Time in Patent Office: Days
• US Class Current: 427/430.1
• CPC Class Codes: C23C 18/1619 Apparatus for electroless plating
• CPC Class Codes: C23C 18/1669 Agitation, e.g. air introduction
• CPC Class Codes: C23C 18/1676 Heating of the solution
• CPC Class Codes: C23C 18/1678 Heating of the substrate
• CPC Class Codes: C23C 18/1682 Control of atmosphere
• CPC Class Codes: H01L 21/288 from a liquid, e.g. electrolytic deposition
• CPC Class Codes: H01L 21/7681 involving one or more buried masks
• CPC Class Codes: H01L 21/76814 post-treatment or after-treatment, e.g. cleaning or removal of oxides on underlying conductors
• CPC Class Codes: H01L 21/76843 formed in openings in a dielectric
• CPC Class Codes: H01L 21/76849 the layer being positioned on top of the main fill metal
• CPC Class Codes: H01L 21/76874 for electroless plating
• CPC Class Codes: H01L 21/76877 Filling of holes, grooves or trenches, e.g. vias, with conductive material

Abstract

An electroless plating apparatus controlling the changes in the plating solution along with the elapse of time for performing electroless plating uniformly with a good accuracy and a method thereof are provided. An electroless plating apparatus for applying electroless treatment to a target surface under an atmosphere of a predetermined gas so as to form a conductive film, has a plating tank 21 set so that a target surface of a target object W is close to its inside surface and isolating the target surface from the outside atmosphere, and a plating solution feeding means 26 for feeding a plating solution to the target surface so as to ease the impact of the plating solution on the target surface of the target object W.

Claims

1. An electroless plating apparatus for electroless plating of a target surface in an atmosphere of a predetermined gas to form a conductive film,

said electroless plating apparatus having:

a plating tank set so that said target surface of a target object is close to its inside surface and isolating said target surface from an outside atmosphere and

a plating solution feeding means for feeding said plating solution to said target surface so as to ease impact of the plating solution to said target surface of said target object.

2. An electroless plating apparatus as set forth in claim 1, further having an agitating means for agitating said plating solution in said plating tank.

3. An electroless plating apparatus as set forth in claim 2, wherein said plating solution feeding means feeds said plating solution to a top surface of said agitating means and feeds said plating solution through said agitating means to said target surface.

4. An electroless plating apparatus as set forth in claim 3, wherein said agitating means can rotate and the top surface thereof has an inclined shape from a center of rotation to an outside.

5. An electroless plating apparatus as set forth in claim 2, wherein:

said agitating means has;

a holding unit for receiving said plating solution fed from said plating solution feeding means and

a feed hole formed at a bottom surface of said holding unit, and

said plating solution feeding means feeds said plating solution to said holding unit of said agitating means and feeds said plating solution to said target surface through said feed hole.

6. An electroless plating apparatus as set forth in claim 1, wherein:

said plating tank has a side wall surface formed with a spiral-shaped guide groove to said target object, and

said plating solution feeding means feeds said plating solution to said guide groove in said side wall surface of said plating tank.

7. An electroless plating apparatus as set forth in claim 6, wherein said spiral-shaped guide groove is formed so that a distance from a spiral axis becomes smaller the closer to said target object.

8. An electroless plating apparatus as set forth in claim 1, wherein:

said plating tank has a side wall surface formed with a conical inclined surface, and

said plating solution feeding means feeds said plating solution to said side wall surface of said plating tank.

9. An electroless plating apparatus as set forth in claim 1, further having a holding member provided with a holding surface for holding said target object and able to move said target object in a direction to face said plating tank.

10. An electroless plating apparatus as set forth in claim 9, wherein said holding member has a clamping hole for holding by suction clamping said target object to said holding surface.

11. An electroless plating apparatus as set forth in claim 9, wherein said holding member has a groove formed with a blowing hole for blowing an inert gas or nitrogen-containing gas at an outer periphery of said holding surface.

12. An electroless plating apparatus as set forth in claim 11, wherein:

said holding member has a holding surface of a size substantially equal to said target object, and

said plating tank is set at an edge of said target surface in said target object via a seal member and isolates said target surface from the outside atmosphere.

13. An electroless plating apparatus as set forth in claim 11, wherein:

said holding member has a holding surface larger than said target object, and

said plating tank is set on said holding member via a seal member and isolates said target surface from the outside atmosphere.

14. An electroless plating apparatus as set forth in claim 9, wherein said holding member has a heating means for heating said target object.

15. An electroless plating apparatus as set forth in claim 1, wherein said plating tank has a heating means for heating said predetermined gas and said plating solution in said plating tank.

16. An electroless plating apparatus as set forth in claim 1, wherein said plating solution feeding means feeds said plating solution containing a first metal material for supplying a main ingredient of said conductive film, a complexing agent, a reducing agent, and a pH adjuster and adjusted in pH to a range from neutral to alkaline.

17. An electroless plating apparatus as set forth in claim 16, wherein said plating solution feeding means feeds said plating solution further containing a second metal material for supplying an ingredient for enhancing a barrier property of said conductive film.

18. An electroless plating apparatus as set forth in claim 16, wherein said plating solution feeding means feeds said plating solution further containing a first complexing agent of an amphoteric ion type and a second complexing agent for accelerating a plating reaction.

19. An electroless plating apparatus as set forth in claim 16, further having:

a plating solution tank for holding said plating solution fed to said plating tank and

a pH adjusting means for adjusting a pH of said plating solution in said plating solution tank.

20. An electroless plating apparatus as set forth in claim 1, further having a gas feeding means for feeding an inert gas or nitrogen-containing gas as said predetermined gas to the inside said plating tank.

21. An electroless plating apparatus as set forth in claim 1, further having:

a plating chamber for holding said plating tank and

a gas feeding means for feeding an inert gas or nitrogen-containing gas as said predetermined gas to the inside of said plating chamber.

22. An electroless plating apparatus as set forth in claim 1, further having:

a plating chamber for holding said plating tank,

a standby chamber connected to said plating chamber for loading and unloading said target object, and

a gas feeding means for feeding an inert gas or nitrogen-containing gas as said predetermined gas to the inside of said plating chamber and said standby chamber.

23. An electroless plating apparatus for electroless plating of a target surface to form a conductive film,

said electroless plating apparatus having:

a plating tank for holding a plating solution under an atmosphere of a predetermined gas and

a holding member provided with a holding surface for holding said target object, having a clamping hole for suction clamping said target object to said holding surface, and having a groove formed with a blowing hole for blowing out said predetermined gas at an outer periphery of said holding surface and

dipping said target object held by said holding member in said plating tank for electroless plating.

24. An electroless plating apparatus as set forth in claim 23, wherein said predetermined gas is an inert gas or nitrogen-containing gas.

25. An electroless plating apparatus as set forth in claim 23, wherein said holding member dips said target object so that said target surface of said target object is close to an inside surface of said plating tank.

26. An electroless plating apparatus as set forth in claim 25, wherein said holding member dips said target object in a state with said target surface inclined to a predetermined angle with respect to a surface of said plating solution.

27. An electroless plating apparatus as set forth in claim 23, further having a gas removing means for removing a reaction gas accompanied with electroless plating of said target surface.

28. An electroless plating apparatus as set forth in claim 27, wherein said gas removing means generates an ultrasonic wave with respect to said target surface of said target object dipped in said plating tank.

29. An electroless plating apparatus as set forth in claim 27, wherein said gas removing means discharges one of an inert gas, nitrogen-containing gas, or said plating solution to said target surface of said target object dipped in said plating tank.

30. An electroless plating apparatus as set forth in claim 23, wherein said holding member can rotate.

31. (Deleted)

32. (Deleted)

33. (Deleted)

34. (Deleted)

35. (Deleted)

36. An electroless plating method for electroless plating of a target surface in an atmosphere of a predetermined gas to form a conductive film, said electroless plating method comprising:

setting a plating tank so that said target surface of a target object is isolated from an outside atmosphere and making the inside of said plating tank an atmosphere of a predetermined gas and

feeding a plating solution to said target surface so as to ease impact of the plating solution to said target surface of said target object and performing electroless plating.

37. An electroless plating method as set forth in claim 36, further comprising performing said electroless plating while agitating said plating solution in said plating tank by an agitating means.

38. An electroless plating method as set forth in claim 37, further comprising feeding said plating solution to a top surface of said agitating means and feeding said plating solution through said agitating means to said target surface.

39. An electroless plating method as set forth in claim 36, further comprising feeding said plating solution to a side wall surface of said plating tank and feeding said plating solution to said target surface along said side wall surface.

40. An electroless plating method as set forth in claim 36, further comprising feeding said plating solution containing a first metal material for supplying a main ingredient of said conductive film, a complexing agent, a reducing agent, and a pH adjuster and adjusted in pH to a range from neutral to alkaline.

41. An electroless plating method as set forth in claim 40, further comprising feeding said plating solution further containing a second metal material for supplying an ingredient for enhancing a barrier property of said conductive film.

42. An electroless plating method as set forth in claim 40, further comprising feeding said plating solution further containing a first completing agent of an amphoteric ion type and a second completing agent for accelerating a plating reaction.

43. An electroless plating method as set forth in claim 36, further comprising using an inert gas or nitrogen-containing gas as said predetermined gas.

44. An electroless plating method as set forth in claim 36, further comprising:

having said plating tank set in a plating chamber and

performing said electroless plating in said plating chamber filled with an inert gas or nitrogen-containing gas as said predetermined gas.

45. An electroless plating method dipping a target object in a plating tank holding a plating solution for electroless plating of a target surface of said target object to form a conductive film, said electroless plating method comprising:

placing said target object on a holding surface of a holding member, blowing a predetermined gas from an outer periphery of said holding surface, and in that state holding said target object by suction clamping at said holding surface, and

dipping said target object held by said holding member in said plating tank set to an atmosphere of a predetermined gas so that said target surface is close to an inside surface of said plating tank.

46. An electroless plating method as set forth in claim 45, further comprising dipping said target object in a state with said target surface inclined to a predetermined angle with respect to a surface of said plating solution when dipping said target object in said plating tank.

47. An electroless plating method as set forth in claim 45, further comprising a gas removing step of removing a reaction gas accompanied with electroless plating of said target surface after dipping it in said plating tank.

48. An electroless plating method as set forth in claim 47, wherein said gas removing step generates an ultrasonic wave with respect to said target surface dipped in said plating tank.

49. An electroless plating method as set forth in claim 47, wherein said gas removing step discharges one of an inert gas, nitrogen-containing gas, or said plating solution to said target surface dipped in said plating tank.

50. An electroless plating method as set forth in claim 47, wherein said gas removing step is performed after the elapse of an initial reaction time of electroless plating after dipping said target object in said plating tank.