Semiconductor device processing
First Claim
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1. A method for manufacturing a semiconductor device comprising:
- providing a semiconductor die of a semiconductive material having a channel receiving layer of a first conductivity;
forming a layer of oxidation retardant material over said channel receiving layer;
forming trenches in said channel receiving layer in one region of said channel receiving layer;
forming a termination recess around said trenches said termination recess having exposed surfaces of semiconductive material;
forming another layer of oxidation retardant material over sidewalls and bottom of each of said trenches; and
growing an oxide layer on exposed surfaces of said termination recess.
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Abstract
A process for manufacturing a semiconductor device of the trench variety with reduced feature sizes and improved characteristics which process includes forming a termination structure having a field oxide disposed in a recess below the surface of the semiconductor die in which the active elements of the device are formed, and forming source regions after the major thermal steps have been performed.
43 Citations
20 Claims
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1. A method for manufacturing a semiconductor device comprising:
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providing a semiconductor die of a semiconductive material having a channel receiving layer of a first conductivity;
forming a layer of oxidation retardant material over said channel receiving layer;
forming trenches in said channel receiving layer in one region of said channel receiving layer;
forming a termination recess around said trenches said termination recess having exposed surfaces of semiconductive material;
forming another layer of oxidation retardant material over sidewalls and bottom of each of said trenches; and
growing an oxide layer on exposed surfaces of said termination recess. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method for manufacturing a MOSgated semiconductor switching device, comprising:
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providing a semiconductor die having a channel receiving region of first conductivity;
forming a channel region of second conductivity in said channel receiving region;
forming at least one trench in said semiconductor die extending through said channel region;
forming a gate structure in said at least one trench; and
forming a conductive region of said first conductivity type adjacent each side of said trench in said channel region after forming said gate structure. - View Dependent Claims (17, 18, 19, 20)
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Specification