Semiconductor die including conductive columns
First Claim
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1. A method for forming a semiconductor die package, the method comprising:
- a) providing a mask having an aperture on a semiconductor substrate, wherein a conductive region is on the semiconductor substrate and the aperture in the mask is disposed over the conductive region;
b) placing a pre-formed conductive column within the aperture; and
c) bonding the preformed conductive column to the conductive region, wherein the pre-formed conductive column has substantially the same shape before and after bonding.
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Abstract
A method for processing a semiconductor substrate is disclosed. The method includes providing a mask having an aperture on a semiconductor substrate having a conductive region. An aperture in the mask is disposed over the conductive region. A pre-formed conductive column is placed in the aperture and is bonded to the conductive region.
75 Citations
22 Claims
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1. A method for forming a semiconductor die package, the method comprising:
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a) providing a mask having an aperture on a semiconductor substrate, wherein a conductive region is on the semiconductor substrate and the aperture in the mask is disposed over the conductive region;
b) placing a pre-formed conductive column within the aperture; and
c) bonding the preformed conductive column to the conductive region, wherein the pre-formed conductive column has substantially the same shape before and after bonding. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for forming a semiconductor die package, the method comprising:
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a) forming a passivation layer comprising a first aperture on a conductive region on a semiconductor substrate, wherein the aperture in the mask is disposed over the conductive region;
b) forming an adhesion layer on the passivation layer and on the conductive region;
c) forming a seed layer on the adhesion layer;
d) forming a patterned photoresist layer comprising a second aperture on the passivation layer, wherein the second aperture is over the conductive region and is aligned with the first aperture;
e) electroplating a conductive layer within the second aperture and on the seed layer;
f) depositing solder paste containing a flux within the second aperture and on the electroplated conductive layer;
g) inserting a pre-formed conductive column into the second aperture;
h) placing the pre-formed conductive column on the conductive layer within the second aperture;
i) removing the patterned photoresist layer;
j) etching portions of the adhesion layer and the seed layer disposed around the bonded pre-formed conductive column; and
k) heating the solder paste to bond the pre-formed conductive column to the conductive region on the semiconductor substrate. - View Dependent Claims (12, 13)
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14. A method for forming a semiconductor die package, the method comprising:
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a) forming a mask comprising an aperture disposed over a conductive region on a semiconductor substrate, wherein the aperture is disposed over the conductive region;
b) plating a conductive column within the second aperture and on the conductive region; and
c) removing the mask from the semiconductor substrate. - View Dependent Claims (15, 16, 17)
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18. A semiconductor die package comprising:
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a) a semiconductor die;
b) a conductive region on the semiconductor substrate;
c) a passivation layer comprising an aperture on the semiconductor substrate, wherein the aperture is disposed over the conductive region; and
d) a pre-formed, conductive column comprising a lead-free, conductive columnar body and a coating on a conductive columnar body. - View Dependent Claims (19, 20, 21, 22)
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Specification