3D MEMS/MOEMS package

• US 20040140475A1
• Filed: 01/21/2003
• Published: 07/22/2004
• Est. Priority Date: 01/21/2003
• Status: Abandoned Application

• Current Assignee: United Test and Assembly Center Limited (UTAC Holdings Ltd.)
• Original Assignee: United Test and Assembly Center Limited (UTAC Holdings Ltd.)
• Inventors: Sun, Yi-Sheng, Chong Yok Rue, Desmond, Kapoor, Rahul
• Application Number:
  US10/347,406
• Publication Number:
  US 20040140475A1
• Time in Patent Office: Days
• US Class Current: 257/100
• CPC Class Codes: B81B 7/0006 Interconnects
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate

Abstract

Two substrates each carrying MEMS or MOEMS structures are bonded face to face and interconnected to form a compact surface-mountable package.

Claims

1. A packaged MEMS or MOEMS device comprising:

a first substrate having on a first surface thereof at least one MEMS or MOEMS structure; and

a second substrate opposing and spaced from said first surface of said first substrate, having at least one MEMS or MOEMS structure on a first surface thereof opposing said first surface of said first substrate and said second substrate being bonded to said first surface of said first substrate.

2. A device according to claim 1 wherein said first substrate has on its first surface contacts for surface mounting of the device.

3. A device according to claim 1 or 2 further comprising a plurality of joints between said first and second substrates to make electrical interconnections between structures on said first substrate.

4. A device according to claim 1, 2 or 3 further comprising an hermetic seal between said first and second substrates enclosing said MEMS or MOEMS structure.

5. A device according to claim 1, 2, 3 or 4 wherein said first and second substrates are bonded together by a polymeric material.

6. A device according to any one of the preceding claims wherein said first substrate is made of an organic material.

7. A device according to any one of the preceding claims wherein said second substrate is formed by silicon or glass.

8. A device according to any one of the preceding claims wherein the separation between said first and second substrates is in the range of from 1 to 20 μ

m.

9. A method of packaging a plurality of MEMS or MOEMS device provided on respective first surfaces of a first and a second substrate, the method comprising the step of:

bonding said second substrate to said first substrate in a spaced apart relationship so that said respective first surfaces oppose each other.

10. A method according to claim 9 further comprising the step of providing electrical contacts for electrical connection to terminals to enable surface mounting of said packaged device.

11. A method according to claim 9 or 10 wherein said step of bonding comprises forming a ring of epoxy resin around said MEMS or MOEMS device.

12. A method according to claim 9, 10 or 11 further comprising the step of forming electrical interconnections between device formed on said first substrate via said second substrate.

13. A method according to any one of claims 9 to 12 further comprising the step of forming an hermetic seal between said first and second substrate around said MEMS or MOEMS devices.

14. A method according to any one of claims 9 to 13 wherein a plurality of MEMS or MOEMS devices are provided on each of said first and second substrates and said devices are singulated after bonding of said second substrate to said first substrate.