Semiconductor device having poly-poly capacitor
First Claim
1. A semiconductor device comprising:
- an MOS capacitor that comprises, a first-conductivity-type diffusion layer formed in a surface of a substrate, a gate oxide film formed on said first-conductivity-type diffusion layer, and a first polysilicon layer formed on said gate oxide film and doped with a dopant of the first conductivity type or a second conductivity type; and
a Poly-Poly capacitor that comprises, said first polysilicon layer, a first dielectric layer formed on said first polysilicon layer, and a second polysilicon layer formed on said first dielectric layer and doped with a dopant of the first conductivity type or the second conductivity type, said Poly-Poly capacitor being stacked on said MOS capacitor, and said first-conductivity-type diffusion layer and said second polysilicon layer being electrically connected to a same first metal interconnection.
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Accused Products
Abstract
Concerning a semiconductor device having a stacked capacitor including MOS and Poly-Poly capacitors, a semiconductor device structured without a need for excessive fine processing is provided. Also, a semiconductor device is provided which offers an increased capacitance density, while suppressing increases in manufacturing process and manufacturing cost. A highly-conductive diffusion layer doped with an N-type or P-type dopant is formed on a semiconductor substrate. A gate oxide film is formed in the surface of the highly-conductive diffusion layer by oxidizing the highly-conductive diffusion layer. A first polysilicon layer doped with an N-type or P-type dopant is formed on the gate oxide film. A dielectric layer is formed on the first polysilicon layer. A second polysilicon layer doped with an N-type or P-type dopant is formed on the dielectric layer. A first aluminum interconnection provided on an insulating layer is electrically connected to the highly-conductive diffusion layer and the second polysilicon layer through a contact hole.
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Citations
10 Claims
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1. A semiconductor device comprising:
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an MOS capacitor that comprises, a first-conductivity-type diffusion layer formed in a surface of a substrate, a gate oxide film formed on said first-conductivity-type diffusion layer, and a first polysilicon layer formed on said gate oxide film and doped with a dopant of the first conductivity type or a second conductivity type; and
a Poly-Poly capacitor that comprises, said first polysilicon layer, a first dielectric layer formed on said first polysilicon layer, and a second polysilicon layer formed on said first dielectric layer and doped with a dopant of the first conductivity type or the second conductivity type, said Poly-Poly capacitor being stacked on said MOS capacitor, and said first-conductivity-type diffusion layer and said second polysilicon layer being electrically connected to a same first metal interconnection. - View Dependent Claims (2, 3, 4)
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5. A semiconductor device comprising:
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a first Poly-Poly capacitor that comprises, a spiral-shaped first polysilicon electrode, a spiral-shaped second polysilicon electrode formed parallel to the shape of said first polysilicon electrode, and a third dielectric layer interposed between said first polysilicon electrode and said second polysilicon electrode. - View Dependent Claims (6, 7, 8, 9, 10)
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Specification