Semiconductor device
First Claim
1. A semiconductor device adapted to be mounted on a board and to be electrically connected to the board, comprising, at least two semiconductor chips, and a substrate on which the semiconductor chips are mounted and to which the semiconductor chips are electrically connected, in such a manner that the semiconductor chips are mounted on and electrically connected to the board through the substrate, wherein a thickness of each of the semiconductor chips in a direction in which the each of the semiconductor chips and the substrate are stacked is smaller than a thickness of the substrate in the direction.
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Accused Products
Abstract
In a semiconductor device adapted to be mounted on a board and to be electrically connected to the board, comprising, at least two semiconductor electric chips, and a substrate on which the semiconductor electric chips are mounted and to which the semiconductor electric chips are electrically connected, in such a manner that the semiconductor electric chips are mounted on and electrically connected to the board through the substrate, according to the present invention, a thickness of each of the semiconductor electric chips in a direction in which the each of the semiconductor electric chips and the substrate are stacked is smaller than a thickness of the substrate in the direction.
68 Citations
1 Claim
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1. A semiconductor device adapted to be mounted on a board and to be electrically connected to the board, comprising,
at least two semiconductor chips, and a substrate on which the semiconductor chips are mounted and to which the semiconductor chips are electrically connected, in such a manner that the semiconductor chips are mounted on and electrically connected to the board through the substrate, wherein a thickness of each of the semiconductor chips in a direction in which the each of the semiconductor chips and the substrate are stacked is smaller than a thickness of the substrate in the direction.
Specification