Electronic module having compliant spacer

• US 20040140554A1
• Filed: 01/21/2003
• Published: 07/22/2004
• Est. Priority Date: 01/21/2003
• Status: Active Grant

• Current Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Original Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Inventors: Kataria, Vijay, Bednarz, Jacob A.
• Granted Patent: US 6,921,973 B2
• Time in Patent Office: Days
• US Class Current: 257/706
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 23/433 Auxiliary members in containers characterised by their shape, e.g. pistons
• CPC Class Codes: H01L 25/115 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 2201/0133 Elastomeric or compliant polymer elastomeric conductor H05K2201/0314
• CPC Class Codes: H05K 2201/2036 Permanent spacer or stand-off in a printed circuit or printed circuit assembly pattern for applying drops or paste H05K2203/0545
• CPC Class Codes: H05K 3/301 by means of a mounting structure H05K3/325 takes precedence

Abstract

The present invention provides for an electronic control module including a support board, an electronic package, and a compliant spacer disposed between the electronic package and the support board. The compliant spacer may include a compliant rubber spacer having a hollow section. A heat sink member is thermally coupled to the electronic package.

Claims

1. An electronic module comprising:

a support board;

an electronic package;

a compliant spacer disposed between the electronic package and the support board; and

a heat sink member thermally coupled to the electronic package.

2. The electronic module as defined in claim 1, wherein the compliant spacer has a hardness of less than 80 durometer.

3. The electronic module as defined in claim 1, wherein the compliant spacer comprises rubber.

4. The electronic module as defined in claim 3, wherein the compliant spacer comprises a silicon rubber.

5. The electronic module as defined in claim 1, wherein the compliant spacer comprises a hollow section.

6. The electronic module as defined in claim 1 further comprising a thermally conductive adhesive adhering the heat sink member to the electronic package.

7. The electronic module as defined in claim 1, wherein the electronic package comprises a thermal tab in thermally conducting relationship with the heat sink member.

8. The electronic module as defined in claim 1, wherein the supporting surface comprises a circuit board.

9. The electronic module as defined in claim 8, wherein the circuit board comprises a printed circuit board.

10. The electronic module as defined in claim 1, wherein the electronic package comprises at least one transistor.

11. The electronic module as defined in claim 1, wherein the electronic package has control circuitry to form an electronic control module.

12. An electronic control module comprising:

a circuit board;

an electronic package;

a compliant spacer disposed between the electronic package and the circuit board; and

a heat sink member thermally coupled to the electronic package.

13. The electronic control module as defined in claim 12, wherein the compliant spacer has a hardness of less than 80 durometer.

14. The electronic control module as defined in claim 12, wherein the compliant spacer comprises rubber.

15. The electronic control module as defined in claim 14, wherein the compliant spacer comprises a silicon rubber.

16. The electronic control module as defined in claim 12, wherein the compliant spacer comprises a hollow section.

17. The electronic control module as defined in claim 12 further comprising a thermally conductive adhesive adhering the heat sink member to the electronic package.

18. The electronic module as defined in claim 12, wherein the electronic package comprises a thermal tab in thermally conducting relationship with the heat sink member.

19. The electronic control module as defined in claim 12, wherein the circuit board comprises a printed circuit board.

20. The electronic control module as defined in claim 12, wherein the electronic package comprises at least one transistor.