Wl-bga for MEMS/MOEMS devices

• US 20040140557A1
• Filed: 01/21/2003
• Published: 07/22/2004
• Est. Priority Date: 01/21/2003
• Status: Abandoned Application

• Current Assignee: United Test and Assembly Center Limited (UTAC Holdings Ltd.)
• Original Assignee: United Test and Assembly Center Limited (UTAC Holdings Ltd.)
• Inventors: Kapoor, Rahul, Sun, Yi-Sheng, Chong Yok Rue, Desmond
• Application Number:
  US10/347,344
• Publication Number:
  US 20040140557A1
• Time in Patent Office: Days
• US Class Current: 257/734
• CPC Class Codes: B81B 7/0006 Interconnects
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A MEMS/MOEMS device is provided on a first substrate which is bonded to a second substrate to form a package. Interconnections may be provided via the second substrate and an hermetic seal may be formed to protect the MEMS/MOEMS device from outgassing.

Claims

1. A packaged MEMS or MOEMS device comprising:

a first substrate having on a first surface thereof at least one MEMS or MOEMS structure; and

a second substrate opposing and spaced from said first surface of said first substrate to cover said MEMS or MOEMS structure, said second substrate being bonded to said first surface of said first substrate.

2. A device according to claim 1 wherein said first substrate has on its first surface contacts for surface mounting of the device.

3. A device according to claim 1 or 2 further comprising a plurality of joints between said first and second substrates to make electrical interconnections between structures on said first substrate.

4. A device according to claim 1, 2 or 3 further comprising an hermetic seal between said first and second substrates enclosing said MEMS or MOEMS structure.

5. A device according to claim 1, 2, 3 or 4 wherein said first and second substrates are bonded together by a polymeric material.

6. A device according to any one of the preceding claims wherein said first substrate is made of an organic material.

7. A device according to any one of the preceding claims wherein said second substrate is formed by silicon or glass.

8. A device according to any one of the preceding claims wherein the separation between said first and second substrates is in the range of from 1 to 20 μ

m.

9. A method of packaging a MEMS or MOEMS device provided on a first surface of a first substrate, the method comprising the step of:

bonding a second substrate to said first surface of said first substrate in a spaced apart relationship to cover said MEMS or MOEMS device.

10. A method according to claim 9 further comprising the step of providing electrical contacts for electrical connection to terminals to enable surface mounting of said packaged device.

11. A method according to claim 9 or 10 wherein said step of bonding comprises forming a ring of epoxy resin around said MEMS or MOEMS device.

12. A method according to claim 9, 10 or 11 further comprising the step of forming electrical interconnections between device formed on said first substrate via said second substrate.

13. A method according to any one of claims 9 to 12 further comprising the step of forming an hermetic seal between said first and second substrate around said MEMS or MOEMS devices.

14. A method according to any one of claims 9 to 13 wherein a plurality of MEMS or MOEMS devices are provided on said first substrate and said devices are singulated after bonding of said second substrate to said first substrate.