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Wl-bga for MEMS/MOEMS devices

  • US 20040140557A1
  • Filed: 01/21/2003
  • Published: 07/22/2004
  • Est. Priority Date: 01/21/2003
  • Status: Abandoned Application
First Claim
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1. A packaged MEMS or MOEMS device comprising:

  • a first substrate having on a first surface thereof at least one MEMS or MOEMS structure; and

    a second substrate opposing and spaced from said first surface of said first substrate to cover said MEMS or MOEMS structure, said second substrate being bonded to said first surface of said first substrate.

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