Wl-bga for MEMS/MOEMS devices
First Claim
Patent Images
1. A packaged MEMS or MOEMS device comprising:
- a first substrate having on a first surface thereof at least one MEMS or MOEMS structure; and
a second substrate opposing and spaced from said first surface of said first substrate to cover said MEMS or MOEMS structure, said second substrate being bonded to said first surface of said first substrate.
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Accused Products
Abstract
A MEMS/MOEMS device is provided on a first substrate which is bonded to a second substrate to form a package. Interconnections may be provided via the second substrate and an hermetic seal may be formed to protect the MEMS/MOEMS device from outgassing.
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Citations
14 Claims
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1. A packaged MEMS or MOEMS device comprising:
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a first substrate having on a first surface thereof at least one MEMS or MOEMS structure; and
a second substrate opposing and spaced from said first surface of said first substrate to cover said MEMS or MOEMS structure, said second substrate being bonded to said first surface of said first substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of packaging a MEMS or MOEMS device provided on a first surface of a first substrate, the method comprising the step of:
bonding a second substrate to said first surface of said first substrate in a spaced apart relationship to cover said MEMS or MOEMS device. - View Dependent Claims (10, 11, 12, 13, 14)
Specification