Method of eliminating uncontrolled voids in sheet adhesive layer
First Claim
1. For use in an integrated circuit package, an adhesive layer for affixing one package component to another comprising:
- an adhesive material region; and
at least one venting slot extending within the adhesive material region for controlling a size and location of voids between said adhesive material region and components joined by said adhesive material region during packaging.
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Accused Products
Abstract
A preformed adhesive layer for joining components within integrated circuit packaging includes venting slots for controlling the size and location of voids within an assembled integrated circuit package. Air randomly entrapped between the surfaces of the adhesive layer and adjoining components during assembly will generally release into the venting slots during subsequent assembly and/or mounting steps performed at elevated temperatures, rather than creating internal pressures causing separation of package components or releasing into the encapsulant. Die delamination and encapsulant void problems occurring during reflow or other assembly and mounting processes as a result of entrapped air are avoided.
6 Citations
22 Claims
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1. For use in an integrated circuit package, an adhesive layer for affixing one package component to another comprising:
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an adhesive material region; and
at least one venting slot extending within the adhesive material region for controlling a size and location of voids between said adhesive material region and components joined by said adhesive material region during packaging. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An integrated circuit package comprising:
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a first package component;
a second package component; and
an adhesive layer affixing said first and second package components to each other, said adhesive layer comprising;
an adhesive material region; and
at least one venting slot extending within the adhesive material region for controlling a size and location of voids between said adhesive layer and said first or second component during packaging. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. For use in an integrated circuit package, a method of affixing one package component to another comprising:
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forming an adhesive material region; and
forming at least one venting slot extending within the adhesive material region for controlling a size and location of voids between said adhesive material region and components joined by said adhesive layer during packaging. - View Dependent Claims (18, 19, 20, 21, 22)
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Specification