Organic light emitting device (OLED) display with improved light emission using a metallic anode

• US 20040140758A1
• Filed: 01/17/2003
• Published: 07/22/2004
• Est. Priority Date: 01/17/2003
• Status: Abandoned Application

• Current Assignee: Eastman Kodak Company
• Original Assignee: Eastman Kodak Company
• Inventors: Shore, Joel D., Raychaudhuri, Pranab K., Madathil, Joseph K.
• Application Number:
  US10/347,013
• Publication Number:
  US 20040140758A1
• Time in Patent Office: Days
• US Class Current: 313/504
• CPC Class Codes: H10K 2102/3026 Top emission
• CPC Class Codes: H10K 2102/351 Thickness
• CPC Class Codes: H10K 50/17 Carrier injection layers
• CPC Class Codes: H10K 50/81 Anodes
• CPC Class Codes: H10K 50/816 Multilayers, e.g. transparent multilayers
• CPC Class Codes: H10K 50/818 Reflective anodes, e.g. ITO combined with thick metallic layers
• CPC Class Codes: H10K 50/828 Transparent cathodes, e.g. comprising thin metal layers
• CPC Class Codes: H10K 50/85 Arrangements for extracting light from the devices
• CPC Class Codes: H10K 59/80517 Multilayers, e.g. transparent multilayers
• CPC Class Codes: H10K 59/80518 Reflective anodes, e.g. ITO combined with thick metallic layers
• CPC Class Codes: H10K 59/80524 Transparent cathodes, e.g. comprising thin metal layers
• CPC Class Codes: H10K 59/875 Arrangements for extracting light from the devices

Abstract

OLED devices, suitable for top and bottom emitters is disclosed. For the top emitting OLED it includes a transparent substrate; a reflective, weakly absorbing, and conductive anode layer including a metal or metal alloy or both formed over the substrate; a hole-injection layer; a plurality of organic layers formed over the hole-injection layer and including an emissive layer having electroluminescent material and an electron transport layer disposed over the emissive layer; a reflective and conductive cathode including a metal or metal alloy or both provided over the electron transport layer; and the transparency and reflectivity of the anode structure, reflectivity of cathode structure, and the thickness of the organic layers between the electrodes being selected to change the internal reflection of light to thereby improve the emission and obtain luminance through-substrate exceeding that of an optimized control device not having the reflective, weakly absorbing, and conductive anode.

Claims

1. A bottom-emitting OLED device, comprising:

(a) a transparent substrate;

(b) a reflective, weakly absorbing, and conductive anode layer including a metal or metal alloy or both formed over the substrate;

(c) a hole-injection layer deposited over the reflective, weakly absorbing, and conductive anode layer;

(d) a plurality of organic layers formed over the hole-injection layer and including an emissive layer having electroluminescent material and an electron transport layer disposed over the emissive layer;

(e) a reflective and conductive cathode including a metal or metal alloy or both provided over the electron transport layer; and

(f) the transparency and reflectivity of the anode structure, reflectivity of cathode structure, and the thickness of the organic layers between the electrodes being selected to change the internal reflection of light to thereby improve the emission and obtain through-substrate exceeding that of an optimized control device not having the reflective, weakly absorbing, and conductive anode.

2. The bottom-emitting OLED device of claim 1 wherein the plurality of organic layers includes a hole-transport layer disposed between the hole injection layer and the emissive layer.

3. The bottom-emitting OLED device of claim 1 which further includes a transmission enhancement layer (TEL) between the transparent substrate and the reflective, weakly absorbing, and conductive anode layer to further improve the amount of light which passes through the anode.

4. The bottom-emitting OLED device of claim 1 wherein the reflective, weakly absorbing, and conductive anode includes Ag, Al, Mg, Zn, Rh, Ru, Ir, Au, Cu, Pd, Ni, Cr, Pt, Co, Te, or Mo or alloys or mixtures thereof.

5. The bottom-emitting OLED device of claim 1 wherein the reflective, weakly absorbing, and conductive anode layer has an absorbance of 30% or less.

6. The bottom-emitting OLED device of claim 1 wherein the reflective and conductive cathode includes metal or metal alloys having a work function selected to be about 4.0 eV or less.

7. The bottom-emitting OLED device of claim 6 wherein the metal or metal alloys include alloys of Ag or Al with Mg, alkali metals, alkali earth metals, or Mn.

8. The bottom-emitting OLED device of claim 1 wherein the hole injection layer includes CF_x, ITO, IZO, Pr₂O₃, TeO₂, CuPC, SiO₂, VO_x, MoO_x, or mixtures thereof.

9. The bottom-emitting OLED device of claim 3 wherein the TEL includes ITO, MgO, MoO_x, SnO₂, TiO₂, Al₂O₃, SiO₂, ZnO, ZrO₂, Alq, NPB, SiN, AlN, TiN, SiC, Al₄C₃, or mixtures thereof.

10. The bottom-emitting OLED device of claim 9 wherein the thickness of the TEL ranges from 20 nm to 150 nm.

11. The bottom-emitting OLED device of claim 1 wherein the combined thickness of all layers between the anode and cathode is in the range of 90 nm to 150 nm or 230 nm to 330 nm.

12. The bottom-emitting OLED device of claim 1 wherein the hole transport layer includes NPB.

13. The bottom-emitting OLED device of claim 1 wherein the emissive layer includes Alq.

14. The bottom-emitting OLED device of claim 1 wherein the electron-transport layer includes Alq.

15. The bottom-emitting OLED device of claim 13 wherein the emissive layer contains fluorescent or phosphorescent dopants.

16. The bottom-emitting OLED device of claim 12 wherein the thickness of the hole-transport layer is in the range of 20 nm to 80 nm or 180 nm to 230 nm.

17. The bottom-emitting OLED device of claim 5 wherein the thickness of the anode layer is in a range of from 4 nm to 50 nm.

18. The bottom-emitting OLED device of claim 7 wherein the thickness of the cathode layer is in a range of from 50 nm to 500 nm.

19. The bottom-emitting OLED device of claim 1 which includes an ultrathin cathode over the electron transport layer.

20. The bottom-emitting OLED device of claim 1 which further includes a highly reflective, substantially opaque metal/alloy over the ultrathin cathode.

21. The bottom-emitting OLED device of claim 20 wherein the highly reflective, substantially opaque metals include Ag, Al, Mg, Zn, Au or Cu or alloys or mixtures thereof.

22. A top-emitting OLED device, comprising:

(a) a transparent or opaque substrate;

(b) a reflective, substantially opaque, and conductive anode layer including a metal or metal alloy or both formed over the substrate;

(c) a hole-injection layer deposited over the reflective, substantially opaque, and conductive anode layer;

(d) a plurality of organic layers formed over the hole-injection layer and including an emissive layer having electroluminescent material and an electron transport layer disposed over the emissive layer;

(e) a reflective, semitransparent, and conductive cathode including a metal or metal alloy or both provided over the electron transport layer; and

(f) the reflectivity of the anode structure, the transparency of the cathode, and the thickness of the organic layers between the electrodes being selected to change the internal reflection of light to thereby improve the emission through the top electrode.

23. The top-emitting OLED device of claim 22 wherein the plurality of organic layers includes a hole-transport layer disposed between the hole injection layer and the emissive layer.

24. The top-emitting OLED device of claim 22 which further includes a transmission enhancement layer (TEL) over the reflective, semitransparent and conductive cathode to further improve the amount of light which passes through the cathode.

25. The top-emitting OLED device of claim 22 wherein the reflective, substantially opaque and conductive anode includes Ag, Al, Mg, Zn, Rh, Ru, Ir, Au, Cu, Pd, Ni, Cr, Pt, Co, Te, Mo, Hf, Fe, Mn, Nb, Ge, Os, Ti, V or W, or alloys or mixtures thereof.

26. The top-emitting OLED device of claim 22 wherein the reflective, semitransparent and conductive cathode has an absorbance of 30% or less.

27. The top-emitting OLED device of claim 22 wherein the reflective, substantially opaque, and conductive anode layer includes metal or metal alloys having a work function selected to be greater than about 4.0 eV.

28. The top-emitting OLED device of claim 22 wherein the hole injection layer includes CF_x, ITO, IZO, Pr₂O₃, TeO₂, CuPc, SiO₂, VO_x, MoO_x, or mixtures thereof.

29. The top-emitting OLED device of claim 24 wherein the TEL includes ITO, MgO, MoO_x, SnO₂, TiO₂, Al₂O₃, SiO₂, ZnO, ZrO₂ Alq, NPB, SiN, AlN, TiN, SiC or Al₄C₃ or mixtures thereof.

30. The top-emitting OLED device of claim 29 wherein the thickness of the TEL ranges from 20 nm to 150 nm.

31. The top-emitting OLED device of claim 22 wherein the hole transport layer includes NPB.

32. The top-emitting OLED device of claim 22 wherein the emissive layer includes Alq.

33. The top-emitting OLED device of claim of claim 22 wherein the electron-transport layer includes Alq.

34. The top-emitting OLED device of claim 32 wherein the emissive layer contains fluorescent or phosphorescent dopants.

35. The top-emitting OLED device of claim 31 wherein the thickness of the hole-transport layer is 30 to 80 nm or 160 to 230 nm.

36. The top-emitting OLED device of claim 22 wherein the total thickness of organic layers is 90 to 140 nm or 220 to 290 nm.

37. The top-emitting OLED device of claim 25 wherein the thickness of the anode layer is in a range of from 50 nm to 500 nm

38. The top-emitting OLED device of claim 26 wherein the thickness of the cathode layer is in a range of from 5 nm to 50 nm.

39. The top-emitting OLED device of claim 22, which includes an ultrathin cathode over the electron transport layer.

40. The top-emitting OLED device of claim 22, which further includes a highly reflective, semitransparent metal/alloy over the ultrathin cathode.

41. The top-emitting OLED device of claim 40 wherein the highly reflective, semitransparent metals include Ag, Al, Mg, Zn, Au or Cu or alloys or mixtures thereof.