Light-emitting diode and method for its production
First Claim
1. A light-emitting diode, comprising:
- a light-emitting diode chip;
a base with a cup part in which said light-emitting diode chip is placed;
a resin material introduced inside said cup part;
a lens member placed on top of said cup part for focusing an emission from said light-emitting diode chip, said lens member projecting out toward said light-emitting diode chip into said cup part and having an inner convex face; and
a fluorescent material applied at least partially over said inner convex face for converting a wavelength of at least some of said emission from said light-emitting diode chip, wherein said inner convex face adheres closely, without any clearance, with said resin material at least around said light-emitting diode chip.
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Accused Products
Abstract
A light-emitting diode with no fluctuations in optical properties and good sealing properties, and a simple production method for producing this light-emitting diode. The light-emitting diode has a base comprising a cup part on which the light-emitting diode is placed, a resin material introduced into cup part, and a lens member placed on top of a cup for focusing light emitted by a light-emitting diode chip. A layer of fluorescent material, which converts the wavelength of at least some of the light from the light-emitting diode chip, is applied to the inner convex face of the lens member. When the lens member is attached to the base, the inner convex face deforms the resin material and air and excess resin material can be pushed to the outside.
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Citations
8 Claims
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1. A light-emitting diode, comprising:
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a light-emitting diode chip;
a base with a cup part in which said light-emitting diode chip is placed;
a resin material introduced inside said cup part;
a lens member placed on top of said cup part for focusing an emission from said light-emitting diode chip, said lens member projecting out toward said light-emitting diode chip into said cup part and having an inner convex face; and
a fluorescent material applied at least partially over said inner convex face for converting a wavelength of at least some of said emission from said light-emitting diode chip, wherein said inner convex face adheres closely, without any clearance, with said resin material at least around said light-emitting diode chip. - View Dependent Claims (2, 3, 4, 5)
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6. A method of producing a light-emitting diode, comprising:
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disposing a light-emitting diode chip inside a cup part on a base;
forming a lens member having an inner convex face that engages with said base;
applying a fluorescent material over said inner convex face;
introducing a resin material into said cup part; and
deforming and moving at least a portion of said resin material by pushing said resin material by said inner convex face on which said fluorescent material has been applied. - View Dependent Claims (7, 8)
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Specification