Light-emitting diode and method for its production

• US 20040140765A1
• Filed: 12/29/2003
• Published: 07/22/2004
• Est. Priority Date: 10/09/2001
• Status: Active Grant

• Current Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Original Assignee: Agilent Technologies, Inc.
• Inventors: Takekuma, Akira
• Granted Patent: US 7,214,116 B2
• Time in Patent Office: Days
• US Class Current: 313/512
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

A light-emitting diode with no fluctuations in optical properties and good sealing properties, and a simple production method for producing this light-emitting diode. The light-emitting diode has a base comprising a cup part on which the light-emitting diode is placed, a resin material introduced into cup part, and a lens member placed on top of a cup for focusing light emitted by a light-emitting diode chip. A layer of fluorescent material, which converts the wavelength of at least some of the light from the light-emitting diode chip, is applied to the inner convex face of the lens member. When the lens member is attached to the base, the inner convex face deforms the resin material and air and excess resin material can be pushed to the outside.

Claims

1. A light-emitting diode, comprising:

a light-emitting diode chip;

a base with a cup part in which said light-emitting diode chip is placed;

a resin material introduced inside said cup part;

a lens member placed on top of said cup part for focusing an emission from said light-emitting diode chip, said lens member projecting out toward said light-emitting diode chip into said cup part and having an inner convex face; and

a fluorescent material applied at least partially over said inner convex face for converting a wavelength of at least some of said emission from said light-emitting diode chip, wherein said inner convex face adheres closely, without any clearance, with said resin material at least around said light-emitting diode chip.

2. The light-emitting diode in claim 1, further comprising a resin material placed inside the above-mentioned cup, wherein said resin material is filled without any clearance in the space demarcated by said inner convex face or said fluorescent material applied to said inner convex face and said cup part.

3. The light-emitting diode in claim 1, wherein said lens member has an engagement face that engages with a part of an inner face of said cup part at a position along a rim of an outer end of said inner convex face.

4. The light-emitting diode in claim 1, wherein said lens member has a shoulder part for engaging with said base along an outer rim thereof.

5. The light-emitting diode in claim 1, wherein said lens part has a groove extending from a position on said inner convex face to an outer rim, through which some of said resin material can pass when said lens part is engaged with said base.

6. A method of producing a light-emitting diode, comprising:

disposing a light-emitting diode chip inside a cup part on a base;

forming a lens member having an inner convex face that engages with said base;

applying a fluorescent material over said inner convex face;

introducing a resin material into said cup part; and

deforming and moving at least a portion of said resin material by pushing said resin material by said inner convex face on which said fluorescent material has been applied.

7. The method of producing a light-emitting diode in claim 6, wherein said lens part has an engagement face that engages with part of an inner face of said cup part at a position along a rim of an outer end of said inner convex face, wherein said lens member is aligned as a result of engagement between said engagement face and said cup part.

8. The method of producing a light-emitting diode in claim 6, wherein said lens member has a groove extending from a position on said inner convex face to an outer rim such that when said lens member is positioned up on said base, some of said resin material makes its way into said groove.