Substrate and method of forming substrate for fluid ejection device
First Claim
1. A method of forming an opening through a substrate having a first side and a second side opposite the first side, the method comprising:
- forming a trench in the first side of the substrate;
forming a mask layer within the trench;
forming at least one hole in the mask layer;
filling the trench and the at least one hole;
forming a first portion of the opening in the substrate from the second side of the substrate to the mask layer; and
forming a second portion of the opening in the substrate from the second side of the substrate through the at least one hole in the mask layer to the first side of the substrate.
2 Assignments
0 Petitions
Accused Products
Abstract
A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming a trench in the first side of the substrate, forming a mask layer within the trench, forming at least one hole in the mask layer, filling the trench and the at least one hole, forming a first portion of the opening in the substrate from the second side of the substrate to the mask layer, and forming a second portion of the opening in the substrate from the second side of the substrate through the at least one hole in the mask layer to the first side of the substrate.
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Citations
36 Claims
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1. A method of forming an opening through a substrate having a first side and a second side opposite the first side, the method comprising:
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forming a trench in the first side of the substrate;
forming a mask layer within the trench;
forming at least one hole in the mask layer;
filling the trench and the at least one hole;
forming a first portion of the opening in the substrate from the second side of the substrate to the mask layer; and
forming a second portion of the opening in the substrate from the second side of the substrate through the at least one hole in the mask layer to the first side of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of forming a substrate for a fluid ejection device, the method comprising:
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forming a trench in a first side of the substrate;
forming a mask layer within the trench;
forming at least one hole in the mask layer;
filling the trench and the at least one hole; and
forming a fluid opening through the substrate, including forming a fluid channel in the substrate from a second side of the substrate opposite the first side to the mask layer and forming a fluid feed hole in the substrate through the at least one hole in the mask layer to the first side of the substrate. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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25. A substrate for a fluid ejection device, the substrate comprising:
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a first side having a trench formed therein;
a second side opposite the first side;
a mask layer formed within the trench of the first side, the mask layer having at least one hole formed therein;
a fill material disposed within the trench of the first side over the mask layer; and
an opening communicating with the first side and the second side, wherein a first portion of the opening extends from the second side to the mask layer and a second portion of the opening extends through the at least one hole in the mask layer and the fill material to the first side. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36)
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Specification