Apparatus and method for maintaining a dry atmosphere to prevent moisture absorption and allow demoisturization of electronic components

• US 20040143989A1
• Filed: 07/25/2003
• Published: 07/29/2004
• Est. Priority Date: 03/31/2000
• Status: Active Grant

• Current Assignee: Air Liquide Industrial US LP (Air Liquide SA)
• Original Assignee: Air Liquide Industrial US LP (Air Liquide SA)
• Inventors: Boyce, Kristen, Theriault, Martin, Rabia, Stephane
• Granted Patent: US 6,990,750 B2
• Time in Patent Office: Days
• US Class Current: 34/380
• CPC Class Codes: H01L 21/67017 Apparatus for fluid treatment H01L21/67126, H01L21/6715 take precedence
• CPC Class Codes: H01L 21/67769 Storage means

Abstract

The apparatus and method of the present invention relates use of a warm and dry atmosphere in electronic component storage areas. The warm and dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues by removing moisture from the components. In accordance with one aspect of the present invention, a component storage system includes an enclosed component storage area and a dry gas delivery system for delivery of a dry gas to the storage area to prevent moisture from being absorbed by the components, and a temperature control system for controlling a temperature of the dry gas to about 10° C. to about 60° C.

Claims

1. A component storage system comprising:

an enclosed component storage area;

a dry gas delivery system for delivery of a dry gas to the storage area to maintain a dry atmosphere in the storage area and to prevent moisture from being absorbed by the components; and

a temperature control system for controlling a temperature of the dry gas to about 10°

C. to about 60°

C.

2. The system of claim 1, wherein the component storage area is a feeder cart for storing the components.

3. The system of claim 1, wherein the component storage area is a cabinet receiving at least one feeder cart for storing the components.

4. The system of claim 1, wherein the component storage area is a storage cabinet for storing the components.

5. The system of claim 1, wherein the temperature control system controls the temperature of the dry gas to about 20°

C. to about 50°

C.

6. The system of claim 1, wherein a flow rate of the dry gas delivered to the storage area is controlled by a control system including a humidity sensor within the component storage area.

7. The system of claim 1, wherein a temperature and a flow rate of the dry gas are controlled to eliminate moisture from the components while the components are stored in the storage area.

8. The system of claim 7, wherein the temperature and the flow rate of the dry gas are controlled to remove about 0.1% or more of the weight of the components by elimination of moisture while the components are stored in the storage area.

9. The system of claim 7, wherein the temperature and the flow rate of the dry gas are controlled to remove moisture from the components to achieve a moisture level in which moisture accounts for 0.1% or less of the weight of the component.

10. A method eliminating moisture from electronic components, the method comprising:

storing electronic components in a storage area; and

maintaining a warm and dry atmosphere in the storage area by enclosing the storage area and injecting a warm and dry gas into the storage area at a flow rate and temperature which are controlled to eliminate moisture from the components in the storage area.

11. The method of claim 10, wherein the component storage area is a feeder cart for storing the components.

12. The method of claim 10, wherein the component storage area is a cabinet receiving at least one feeder cart for storing the components.

13. The method of claim 10, wherein the component storage area is a storage cabinet for storing the components.

14. The method of claim 10, wherein the temperature control system controls the temperature of the dry gas to about 10°

C. to about 60°

C.

15. The method of claim 10, wherein the temperature control system controls the temperature of the dry gas to about 20°

C. to about 50°

C.

16. The method of claim 10, wherein a flow rate of the dry gas delivered to the storage area is controlled by a control system including a humidity sensor within the component storage area.

17. The method of claim 10, further comprising removing about 0.1% or more of the weight of the components by elimination of moisture while the components are stored in the storage area.