Method and apparatus for cleaning a CVD chamber
First Claim
1. A method for plasma cleaning a chamber for processing a substrate, said chamber having a first portion comprising a substrate support pedestal, a second portion coupled to a source of radio-frequency power, and an electrode electrically isolated from the first portion and the second portion, comprising:
- connecting the electrode to the first portion;
supplying a cleaning gas into the chamber; and
applying radio-frequency power from said source to energize the cleaning gas to a plasma within the second portion.
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Abstract
The present invention is a method and apparatus for cleaning a chemical vapor deposition (CVD) chamber using cleaning gas energized to a plasma in a gas mixing volume separated by an electrode from a reaction volume of the chamber. In one embodiment, a source of RF power is coupled to a lid of the chamber, while a switch is used to couple a showerhead to ground terminals or the source of RF power.
263 Citations
23 Claims
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1. A method for plasma cleaning a chamber for processing a substrate, said chamber having a first portion comprising a substrate support pedestal, a second portion coupled to a source of radio-frequency power, and an electrode electrically isolated from the first portion and the second portion, comprising:
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connecting the electrode to the first portion;
supplying a cleaning gas into the chamber; and
applying radio-frequency power from said source to energize the cleaning gas to a plasma within the second portion. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A semiconductor substrate processing system comprising a chamber for processing a substrate, said chamber comprises:
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a first portion comprising a substrate support pedestal;
a second portion coupled to a source of radio-frequency power;
a showerhead electrically isolated from the first portion and the second portion; and
a switch that couples the showerhead to the first portion or the second portion. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A computer-readable medium containing software that, when executed by a computer, causes a semiconductor substrate processing system to clean a chamber for processing a substrate, said chamber having a first portion comprising a substrate support pedestal, a second portion coupled to a source of radio-frequency power, and an electrode electrically isolated from the first portion and the second portion, using a method, comprising:
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connecting the electrode to the first portion;
supplying a cleaning gas into the chamber; and
applying radio-frequency power from said source to energize the cleaning gas to a plasma within the second portion. - View Dependent Claims (21, 22, 23)
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Specification