Field effect transistor and method of its manufacture
First Claim
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1. A trenched field effect transistor comprising:
- a semiconductor substrate;
a trench extending a predetermined depth into said semiconductor substrate;
a pair of doped source junctions, positioned on opposite sides of the trench;
a doped heavy body positioned adjacent each source junction on the opposite side of the source junction from the trench, the deepest portion of said heavy body extending less deeply into said semiconductor substrate than said predetermined depth of said trench, and a doped well surrounding the heavy body beneath the heavy body.
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Abstract
A trenched field effect transistor is provided that includes (a) a semiconductor substrate, (b) a trench extending a predetermined depth into the semiconductor substrate, (c) a pair of doped source junctions, positioned on opposite sides of the trench, (d) a doped heavy body positioned adjacent each source junction on the opposite side of the source junction from the trench, the deepest portion of the heavy body extending less deeply into said semiconductor substrate than the predetermined depth of the trench, and (e) a doped well surrounding the heavy body beneath the heavy body.
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Citations
45 Claims
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1. A trenched field effect transistor comprising:
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a semiconductor substrate;
a trench extending a predetermined depth into said semiconductor substrate;
a pair of doped source junctions, positioned on opposite sides of the trench;
a doped heavy body positioned adjacent each source junction on the opposite side of the source junction from the trench, the deepest portion of said heavy body extending less deeply into said semiconductor substrate than said predetermined depth of said trench, and a doped well surrounding the heavy body beneath the heavy body. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An array of transistor cells comprising:
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a semiconductor substrate;
a plurality of gate-forming trenches arranged substantially parallel to each other and extending in a first direction, the space between adjacent trenches defining a contact area, each trench extending a predetermined depth into said substrate, the predetermined depth being substantially the same for all of said gate-forming trenches;
surrounding each trench, a pair of doped source junctions, positioned on opposite sides of the trench and extending along the length of the trench;
positioned between each pair of gate-forming trenches, a doped heavy body positioned adjacent each source junction, the deepest portion of each said heavy body extending less deeply into said semiconductor substrate than said predetermined depth of said trenches;
a doped well surrounding each heavy body beneath the heavy body; and
p+ and n+ contacts disposed at the surface of the semiconductor substrate and arranged in alternation along the length of the contact area. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A semiconductor die comprising:
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a plurality of DMOS transistor cells arranged in an array on a semiconductor substrate, each DMOS transistor cell including a gate-forming trench, each of said gate-forming trenches having a predetermined depth, the depth of all of the gate-forming trenches being substantially the same; and
surrounding the periphery of the array, a field termination structure that extends into the semiconductor substrate to a depth that is deeper than said predetermined depth of said gate-forming trenches. - View Dependent Claims (19, 20, 21, 22)
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23. A method of making a heavy body structure for a trenched DMOS transistor comprising:
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providing a semiconductor substrate;
implanting into a region of the substrate a first dopant at a first energy and dosage; and
subsequently implanting into said region a second dopant at a second energy and dosage, said second energy and dosage being relatively less than said first energy and dosage. - View Dependent Claims (24, 25, 26, 27, 28)
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29. A method of making a source for a trenched DMOS transistor comprising:
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providing a semiconductor substrate;
implanting into a region of the substrate a first dopant at a first energy and dosage; and
subsequently implanting into said region a second dopant at a second energy and dosage, said second energy and dosage being relatively less than said first energy and dosage. - View Dependent Claims (30, 31, 32, 33, 34, 35)
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36. A method of manufacturing a trenched field effect transistor comprising:
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forming a field termination junction around the perimeter of a semiconductor substrate;
forming an epitaxial layer on the semiconductor substrate;
patterning and etching a plurality of trenches into the epitaxial layer;
depositing polysilicon to fill the trenches;
doping the polysilicon with a dopant of a first type;
patterning the substrate and implanting a dopant of a second, opposite type to form a plurality of wells interposed between adjacent trenches;
patterning the substrate and implanting a dopant of the second type to form a plurality of second dopant type contact areas and a plurality of heavy bodies positioned above the wells, each heavy body having an abrupt junction with the corresponding well;
patterning the substrate and implanting a dopant of the first type to provide source regions and first dopant type contact areas; and
applying a dielectric to the surface of the semiconductor substrate and patterning the dielectric to expose electrical contact areas. - View Dependent Claims (37, 38, 39, 40, 41, 42, 43, 44, 45)
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Specification