Uv-curable inks for ptf laminates (including flexible circuitry)

• US 20040145089A1
• Filed: 11/12/2003
• Published: 07/29/2004
• Est. Priority Date: 06/19/2001
• Status: Abandoned Application

• Current Assignee: 2461729 Ontario Incorporated
• Original Assignee: 2461729 Ontario Incorporated
• Inventors: Burrows, Kenneth
• Application Number:
  US10/476,494
• Publication Number:
  US 20040145089A1
• Time in Patent Office: Days
• US Class Current: 264/496
• CPC Class Codes: C09K 11/02 Use of particular materials as binders, particle coatings or suspension media therefor
• CPC Class Codes: H05B 33/12 Light sources with substantially two-dimensional radiating surfaces
• CPC Class Codes: H05B 33/20 characterised by the chemical or physical composition or the arrangement of the material in which the electroluminescent material is embedded
• CPC Class Codes: H05K 3/4664 Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders H05K3/4647 takes precedence

Abstract

A polymer Thick Film (“PTF”) laminate, in which selected (and advantageously all) of the layers are deployed using UV-curable inks. In one embodiment of the invention, the UV-curable PTF layers are deployed in an exemplary monolithic and membranous EL structure, in which UV-cured urethane envelope layers encapsulate UV-cured urethane electroluminescent layers. When deployed in layer form during manufacture and subsequently exposed to UV radiation, the inventive inks cure in a few seconds without any appreciable layer height shrinkage. Manufacturing cycle time is significantly optimized over traditional heat curing processes. Flexible circuitry is also disclosed herein. The flexible circuitry may be embodied using the UV-curable urethane inks disclosed herein, although the flexible circuitry is not limited to UV-curable or urethane embodiments. Successive insulating layers are deployed. The insulating layers have conductive pathways deployed thereon. The conductive pathways may be connected in any way desired on a single layer or between layers. Apertures may be left in insulating layers to receive surface mounted components (“SMCs”) that are in conductive communication with conductive pathways deployed on the layer beneath. Active zones may also be deployed between conductive pathways on a layer. Such active zones comprise inks that, when cured, have predesigned electrical characteristics (such as resistance, capacitance, inductance, semiconductance, etc.) when the conductive pathways are energized. In another embodiment, selected layers in the flexible circuitry comprise conductive pathways, active zones and insulating zones all deployed next to one another to form a single multi-function layer. Use of such multi-function layers enables conductive pathways, active zones and insulating zones to be designed into the flexible circuitry with a dimension that is not limited to the general plane of the deployed layer.

Claims

1. A method for constructing a PTF laminate, comprising:

(a) deploying selected PTF layers in the laminate using UV-curable inks; and

(b) curing the UV-curable ink layers via exposure to UV radiation.

2. The method of claim 1, in which the UV-curable inks are selected from the group consisting of

(a) UV-curable urethane acrylate/acrylate monomers;

and

(b) UV-curable epoxy acrylate/acrylate monomers.

3. The method of claim 1, in which the PTF laminate includes EL layers, the EL layers predesigned to combine to electroluminesce when energized;

and in which selected EL layers are deployed using a UV-curable urethane ink and are cured via exposure to UV radiation.

4. The method of claim 1, in which the PTF laminate, when cured, has membranous properties.

5. The method of claim 2, in which the PTF laminate, when cured, has membranous properties.

6. The method of claim 3, in which the PTF laminate, when cured, has membranous properties.

7. The method of claim 1, in which selected neighboring layers in the PTF laminate cure to form a monolithic structure.

8. The method of claim 2, in which selected neighboring layers in the PTF laminate cure to form a monolithic structure.

9. The method of claim 3, in which selected neighboring layers in the PTF laminate cure to form a monolithic structure.

10. The method of claim 1, in which the PTF laminate is constructed onto a temporary substrate, and in which the method further comprises:

(c) removing the temporary substrate.

11. The method of claim 2, in which the PTF laminate is constructed onto a temporary substrate, and in which the method further comprises:

(c) removing the temporary substrate.

12. The method of claim 3, in which the PTF laminate is constructed onto a temporary substrate, and in which the method further comprises:

(c) removing the temporary substrate.

13. The method of claim 1, in which the PTF laminate is constructed directly onto a final destination substrate.

14. The method of claim 2, in which the PTF laminate is constructed directly onto a final destination substrate.

15. The method of claim 3, in which the PTF laminate is constructed directly onto a final destination substrate.

16. The method of claim 13, in which the final destination substrate is a three-dimensionally shaped surface.

17. The method of claim 14, in which the final destination substrate is a three-dimensionally shaped surface.

18. The method of claim 15, in which the final destination substrate is a three-dimensionally shaped surface.

19. The method of claim 13, in which the final destination substrate is porous and/or fibrous.

20. The method of claim 14, in which the final destination substrate is porous and/or fibrous.

21. The method of claim 15, in which the final destination substrate is porous and/or fibrous.

22. The product of the method according to any of claims 1 to 21.

23. A PTF laminate of serially deployed layers, each layer comprising a cured ink, the PTF laminate comprising:

insulating zones deployed in PTF layer form; and

conductive pathways deployed in PTF layer form;

the insulating zones and the conductive pathways cooperatively deployed so as to form, when all layers are cured, a predetermined circuitry of said conductive pathways.

24. The laminate of claim 23, further comprising:

SMCs, the SMCs deployed into apertures in the PTF layers and coupled to conductive pathways deployed in PTF layers;

the SMCs and the insulating zones and the conductive pathways cooperatively deployed so as to form, when all layers are cured, a predetermined circuitry of said conductive pathways and SMCs.

25. The laminate of claim 23, further comprising:

active zones deployed in PTF layer form, the active zones including cured inks giving predesigned electrical functionality to said active zones;

the active zones and the insulating zones and the conductive pathways cooperatively deployed so as to form, when all layers are cured, a predetermined circuitry of said conductive pathways and active zones.

26. The laminate of claim 23, in which the PTF laminate, when cured, has membranous properties.

27. The laminate of claim 23, in which selected neighboring layers in the PTF laminate cure to form a monolithic structure.