×

Miniature optical element for wireless bonding in an electronic instrument

  • US 20040147051A1
  • Filed: 01/20/2004
  • Published: 07/29/2004
  • Est. Priority Date: 07/11/2000
  • Status: Active Grant
First Claim
Patent Images

1. A method of manufacturing an optical element comprising the steps of:

  • forming a through hole in a semiconductor element which has an optical section and an electrode electrically connected to the optical section; and

    forming a conductive layer extending from a first surface of the semiconductor element on which the optical section is formed, through an inner wall surface of the through hole, to a second surface opposite to the first surface.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×