Miniature optical element for wireless bonding in an electronic instrument
First Claim
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1. A method of manufacturing an optical element comprising the steps of:
- forming a through hole in a semiconductor element which has an optical section and an electrode electrically connected to the optical section; and
forming a conductive layer extending from a first surface of the semiconductor element on which the optical section is formed, through an inner wall surface of the through hole, to a second surface opposite to the first surface.
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Abstract
A method of manufacturing an optical element including the steps of: forming a through hole in a semiconductor element which has an optical section and an electrode electrically connected to the optical section; and forming a conductive layer extending from a first surface of the semiconductor element on which the optical section is formed, through an inner wall surface of the through hole, to a second surface opposite to the first surface.
34 Citations
14 Claims
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1. A method of manufacturing an optical element comprising the steps of:
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forming a through hole in a semiconductor element which has an optical section and an electrode electrically connected to the optical section; and
forming a conductive layer extending from a first surface of the semiconductor element on which the optical section is formed, through an inner wall surface of the through hole, to a second surface opposite to the first surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification