Semiconductor assemblies, methods of forming structures over semiconductor substrates, and methods of forming transistors associated with semiconductor substrates
First Claim
1. A method of forming a structure over a semiconductor substrate, comprising:
- forming a silicon dioxide containing layer across at least some of the substrate;
providing nitrogen within the silicon dioxide containing layer, substantially all of the nitrogen within the silicon dioxide being at least 10 Å
above the substrate; and
after providing the nitrogen within the silicon dioxide containing layer, forming conductively doped silicon on the silicon dioxide layer.
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Abstract
The invention encompasses a method of forming a structure over a semiconductor substrate. A silicon dioxide containing layer is formed across at least some of the substrate. Nitrogen is formed within the silicon dioxide containing layer. Substantially all of the nitrogen within the silicon dioxide is at least 10 Å above the substrate. After the nitrogen is formed within the silicon dioxide layer, conductively doped silicon is formed on the silicon dioxide layer. The invention encompasses a method of forming a pair of transistors associated with a semiconductor substrate. First and second regions of the substrate are defined. A first oxide region is formed to cover the first region of the substrate, and to not cover the second region of the substrate. Nitrogen is formed within the first oxide region, and a first conductive layer is formed over the first oxide region. After the first conductive layer is formed, a second oxide region is formed over the second region of the substrate. A second conductive layer is formed over the second oxide region. The first conductive layer is patterned into a first transistor gate, and the second conductive layer is patterned into a second transistor gate. First source/drain regions are formed proximate the first transistor gate, and the second source/drain regions are formed proximate the second transistor gate. The invention also encompasses semiconductor assemblies.
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Citations
35 Claims
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1. A method of forming a structure over a semiconductor substrate, comprising:
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forming a silicon dioxide containing layer across at least some of the substrate;
providing nitrogen within the silicon dioxide containing layer, substantially all of the nitrogen within the silicon dioxide being at least 10 Å
above the substrate; and
after providing the nitrogen within the silicon dioxide containing layer, forming conductively doped silicon on the silicon dioxide layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of forming structures over a semiconductor substrate, comprising:
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forming a first oxide region which covers only a portion of the substrate;
providing nitrogen within the first oxide region, substantially all of the nitrogen within the first oxide region being at least 10 Å
above the substrate;
forming a second oxide region over at least some of the substrate which is not covered by the first oxide region;
forming a first conductively-doped silicon material over the first oxide region and a second conductively-doped silicon material over the second oxide region;
one of the first and second conductively-doped silicon materials being n-type doped and the other being p-type doped. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method of forming a pair of transistors associated with a semiconductor substrate, comprising:
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defining a first region and a second region of the substrate;
forming a first oxide region which covers at least some of the first region of the substrate and which does not cover the second region of the substrate;
providing nitrogen within the first oxide region;
after providing the nitrogen within the first oxide region, forming a first conductive layer over the first oxide region and which does not cover the second region of the substrate;
after forming the first conductive layer, forming a second oxide region over the second region of the substrate;
forming a second conductive layer over the second oxide region;
patterning the first conductive layer into a first transistor gate;
patterning the second conductive layer into a second transistor gate;
forming first source/drain regions proximate the first transistor gate and gatedly connected to one another by the first transistor gate; and
forming second source/drain regions proximate the second transistor gate and gatedly connected to one another by the second transistor gate. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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32. A semiconductor assembly, comprising:
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a semiconductor substrate having a first region and a second region defined therein;
a first oxide region on the substrate and covering the first region of the substrate;
the first oxide region having nitrogen provided therein;
substantially all of the nitrogen being at least 10 Å
above the semiconductor substrate;
a first conductive layer over the first oxide region and defining a first transistor gate;
first source/drain regions proximate the first transistor gate and gatedly connected to one another by the first transistor gate; and
a second oxide region covering the second region of the substrate;
a second conductive layer over the second oxide region and defining a second transistor gate;
second source/drain regions proximate the second transistor gate and gatedly connected to one another by the second transistor gate. - View Dependent Claims (33, 34, 35)
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Specification