Methods and apparatus for forming rhodium-containing layers
First Claim
1. A capacitor, comprising a first conductive layer, a dielectric layer, and a second conductive layer, at least one of said first and second conductive layers containing a CVD platinum-rhodium alloy.
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Abstract
A method of forming a rhodium-containing layer on a substrate, such as a semiconductor wafer, using complexes of the formula LyRhYz is provided. Also provided is a chemical vapor co-deposited platinum-rhodium alloy barriers and electrodes for cell dielectrics for integrated circuits, particularly for DRAM cell capacitors. The alloy barriers protect surrounding materials from oxidation during oxidative recrystallization steps and protect cell dielectrics from loss of oxygen during high temperature processing steps. Also provided are methods for CVD co-deposition of platinum-rhodium alloy diffusion barriers.
108 Citations
80 Claims
- 1. A capacitor, comprising a first conductive layer, a dielectric layer, and a second conductive layer, at least one of said first and second conductive layers containing a CVD platinum-rhodium alloy.
- 6. A capacitor, comprising a dielectric layer, a first conductive layer, a second conductive layer, and a conductive barrier layer containing a CVD platinum-rhodium alloy.
- 12. An integrated circuit comprising a capacitor, said capacitor comprising a first conductive layer, a dielectric layer, and a second conductive layer, at least one of said first and second conductive layers containing a CVD platinum-rhodium alloy.
- 17. An integrated circuit comprising a capacitor, said capacitor comprising a dielectric layer, a first conductive layer, a second conductive layer, and a conductive barrier layer, said barrier layer containing a CVD platinum-rhodium alloy.
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21. A memory cell comprising:
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a transistor; and
a capacitor having a dielectric diffusion barrier layer containing a CVD platinum-rhodium alloy. - View Dependent Claims (22)
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23. A method for fabricating a capacitor comprising the steps of:
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forming a first conductive layer;
forming a dielectric layer atop said first conductive layer;
forming a second conductive layer atop said dielectric layer;
wherein at least one of said first and second conductive layers contains a CVD platinum-rhodium alloy. - View Dependent Claims (24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36)
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37. A method for fabricating a capacitor comprising the steps of:
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forming a first conductive layer;
forming a dielectric layer atop said first conductive layer;
forming a second conductive layer atop said dielectric layer; and
forming a conductive barrier layer containing a platinum-rhodium alloy. - View Dependent Claims (38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50)
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51. A method for fabricating a capacitor having a first and a second electrode, comprising the following steps:
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forming an insulative layer overlying a substrate;
forming an opening in said insulative layer in order to expose said substrate;
forming a conductive plug in said opening, said conductive plug forming a first portion of the first electrode of said capacitor, said conductive plug recessed below a surface of said insulative layer;
forming a first conductive layer, for preventing diffusion of atoms, in said opening and overlying said conductive plug such that said first conductive layer is surrounded on sidewalls by said insulative layer, said first conductive layer forming a second portion of the first electrode, said first conductive layer being formed of a platinum-rhodium alloy co-deposited by chemical vapor deposition; and
forming a second conductive layer overlying said first conductive layer, said second conductive layer forming a third portion of the first electrode. - View Dependent Claims (52, 53, 54, 55, 56, 57, 58, 59)
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60. A method of manufacturing a semiconductor structure, the method comprising:
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providing a semiconductor substrate or substrate assembly;
providing a precursor composition comprising one or more complexes of the formula;
LyRhYz, wherein;
each L group is independently a neutral or anionic ligand;
each Y group is independently a pi bonding ligand selected from the group of CO, NO, CN, CS, N2, PX3, PR3, P(OR)3, AsX3, AsR3, As(OR)3, SbX3, SbR3, Sb(OR)3, NxR3-x, CNR, and RCN, wherein R is an organic group, X is a halide, and x=0 to 3;
y=1 to 4; and
z=0 to 4;
providing a nonhydrogen reaction gas; and
forming a rhodium-containing layer from the precursor composition in the presence of the nonhydrogen reaction gas on a surface of the semiconductor substrate or substrate assembly. - View Dependent Claims (61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72)
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73. A method of manufacturing a semiconductor structure, the method comprising:
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providing a semiconductor substrate or substrate assembly;
providing a precursor composition comprising one or more organic solvents and one or more complexes of the formula;
LyRhYz, wherein;
each L group is independently a neutral or anionic ligand;
each Y group is independently a pi bonding ligand selected from the group of CO, NO, CN, CS, N2, PX3, PR3, P(OR)3, AsX3, AsR3, As(OR)3, SbX3, SbR3, Sb(OR)3, NHxR3-x, CNR, and RCN, wherein R is an organic group, X is a halide, and x=0 to 3;
y=1 to 4;
z=0 to 4; and
providing a nonhydrogen reaction gas; and
vaporizing the precursor composition to form vaporized precursor composition; and
directing the vaporized precursor composition toward the semiconductor substrate or substrate assembly to form a rhodium-containing layer in the presence of the nonhydrogen reaction gas on a surface of the semiconductor substrate or substrate assembly.
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74. A method of forming a layer on a substrate, the method comprising:
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providing a substrate;
providing a precursor composition comprising one or more complexes of the formula;
LyRhYz, wherein;
each L group is independently a neutral or anionic ligand;
each Y group is independently a pi bonding ligand selected from the group of CO, NO, CN, CS, N2, PX3, PR3, P(OR)3, AsX3, AsR3, As(OR)3, SbX3, SbR3, Sb(OR)3, NHxR3-x, CNR, and RCN, wherein R is an organic group, X is a halide, and x=0 to 3;
y=1 to 4; and
z=0 to 4;
providing a nonhydrogen reaction gas; and
forming a rhodium-containing layer from the precursor composition in the presence of the nonhydrogen reaction gas on a surface of the substrate. - View Dependent Claims (75, 76)
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77. A method of forming a layer on a substrate, the method comprising:
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providing a substrate;
providing a precursor composition comprising one or more solvents and one or more complexes of the formula;
LyRhYZ, wherein;
each L group is independently a neutral or anionic ligand;
each Y group is independently a pi bonding ligand selected from the group of CO, NO, CN, CS, N2, PX3, PR3, P(OR)3, AsX3, AsR3, As(OR)3, SbX3, SbR3, Sb(OR)3, NHxR3-x, CNR, and RCN, wherein R is an organic group, X is a halide, and x=0 to 3;
y=1 to 4; and
z=0 to 4;
providing a nonhydrogen reaction gas; and
vaporizing the precursor composition to form vaporized precursor composition; and
directing the vaporized precursor composition toward the substrate to form a rhodium-containing layer in the presence of the nonhydrogen reaction gas on a surface of the substrate.
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78. A method of forming a layer on a substrate, the method comprising:
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providing a substrate;
providing a precursor composition comprising one or more complexes of the formula;
LyRhYz, wherein;
each L group is independently a neutral or anionic ligand;
each Y group is independently a pi bonding ligand selected from the group of CO, NO, CN, CS, N2, PX3, PR3, P(OR)3, AsX3, AsR3, As(OR)3, SbX3, SbR3, Sb(OR)3, NHxR3-x, CNR, and RCN, wherein R is an organic group, X is a halide, and x=0 to 3;
with the proviso that L is not cyclopentadienyl when Y is CO;
y=1 to 4; and
z=1 to 4; and
forming a rhodium-containing layer from the precursor composition on a surface of the substrate.
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79. A method of manufacturing a semiconductor structure, the method comprising:
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providing a semiconductor substrate or substrate assembly;
providing a precursor composition comprising one or more complexes of the formula;
LyRhYz, wherein;
each L group is independently a neutral or anionic ligand;
each Y group is independently a pi bonding ligand selected from the group of CO, NO, CN, CS, N2, PX3, PR3, P(OR)3, AsX3, AsR3, As(OR)3, SbX3, SbR3, Sb(OR)3, NHxR3-x, CNR, and RCN, wherein R is an organic group, X is a halide, and x=0 to 3;
with the proviso that L is not cyclopentadienyl when Y is CO;
y=1 to 4; and
z=1 to 4; and
forming a rhodium-containing layer from the precursor composition on a surface of the semiconductor substrate or substrate assembly.
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80. A chemical vapor deposition apparatus comprising:
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a deposition chamber having a substrate positioned therein;
a vessel containing a precursor composition comprising one or more complexes of the formula;
LyRhYz, wherein;
each L group is independently a neutral or anionic ligand;
each Y group is independently a pi bonding ligand selected from the group of CO, NO, CN, CS, N2, PX3, PR3, P(OR)3, AsX3, AsR3, As(OR)3, SbX3, SbR3, Sb(OR)3, NHxR3-x, CNR, and RCN, wherein R is an organic group, X is a halide, and x=0 to 3;
y=1 to 4; and
z=0 to 4;
a source of an inert carrier gas for transferring the precursor composition to the chemical vapor deposition chamber; and
a source of a nonhydrogen reaction gas.
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Specification