Flexible MEMS transducer manufacturing method
First Claim
1. A method for manufacturing a flexible MEMS transducer, comprising:
- forming a sacrificial layer on a flexible substrate;
sequentially depositing a membrane layer, a lower electrode layer, an active layer, and an upper electrode layer on the sacrificial layer by plasma enhanced chemical vapor deposition (PECVD);
sequentially patterning the upper electrode layer, the active layer, and the lower electrode layer;
depositing an upper protective layer to cover the upper electrode layer, the lower electrode layer, and the active layer;
patterning the upper protective layer to be connected to the lower electrode layer and the upper electrode layer, and then depositing a connecting pad layer and patterning the connecting pad layer to form a first connecting pad to be connected to the lower electrode layer and a second connecting pad to be connected to the upper electrode layer; and
patterning the membrane layer to expose the sacrificial layer and removing the sacrificial layer.
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Abstract
A method for manufacturing a flexible MEMS transducer includes forming a sacrificial layer on a flexible substrate, sequentially depositing a membrane layer, a lower electrode layer, an active layer, and an upper electrode layer on the sacrificial layer by PECVD, sequentially patterning the upper electrode layer, the active layer, and the lower electrode layer, depositing an upper protective layer to cover the upper electrode layer, the lower electrode layer, and the active layer, patterning the upper protective layer to be connected to the lower electrode layer and the upper electrode layer, and then depositing a connecting pad layer and patterning the connecting pad layer to form a first connecting pad to be connected to the lower electrode layer and a second connecting pad to be connected to the upper electrode layer; and patterning the membrane layer to expose the sacrificial layer and removing the sacrificial layer.
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Citations
28 Claims
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1. A method for manufacturing a flexible MEMS transducer, comprising:
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forming a sacrificial layer on a flexible substrate;
sequentially depositing a membrane layer, a lower electrode layer, an active layer, and an upper electrode layer on the sacrificial layer by plasma enhanced chemical vapor deposition (PECVD);
sequentially patterning the upper electrode layer, the active layer, and the lower electrode layer;
depositing an upper protective layer to cover the upper electrode layer, the lower electrode layer, and the active layer;
patterning the upper protective layer to be connected to the lower electrode layer and the upper electrode layer, and then depositing a connecting pad layer and patterning the connecting pad layer to form a first connecting pad to be connected to the lower electrode layer and a second connecting pad to be connected to the upper electrode layer; and
patterning the membrane layer to expose the sacrificial layer and removing the sacrificial layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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Specification