Optical-interference type display panel and method for making the same

• US 20040147198A1
• Filed: 01/08/2004
• Published: 07/29/2004
• Est. Priority Date: 01/29/2003
• Status: Active Grant

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Prime View International Company Limited (E Ink Holdings Incorporated)
• Inventors: Lin, Wen-Jian, Tsai, Hsiung-Kuang, Hsu, Hung-Huei
• Granted Patent: US 7,172,915 B2
• Time in Patent Office: Days
• US Class Current: 445/24
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26

Abstract

An optical-interference type display panel and a method for making the same are disclosed, wherein the display panel has a substrate on which multiple first conductive optical film stacks, supporting layers and multiple second conductive optical film stacks are formed. The substrate further has a plurality of connecting pads consisting of a transparent conductive film of the first conductive optical film stacks. Since the transparent conductive film is made of indium tin oxide, these connecting pads have the excellent anti-oxidation ability at their surface.

Claims

1. A method for making an optical interference type display panel, the method comprising the steps of:

providing a substrate (10);

sequentially forming a plurality of first conductive optical film stacks (20), a supporting layer (11), a spacing layer (12) and a plurality of second conductive optical film stacks (13) on the substrate (10); and

forming a plurality of connecting pads (201)(202) near edges of the substrate (10), wherein the plurality of connecting pads (201)(202) is made of a transparent conductive layer (21) of the first conductive optical film stack (20).

2. The method as claimed in claim 1, the method further comprising the steps of:

forming the plurality of separated first conductive optical film stacks (20) on the substrate (10);

defining patterns of connecting pads, wherein portions of these first conductive optical film stacks (20) are further patterned to form the plurality of connecting pads (201)(202);

forming the supporting layer (11) on the substrate (10), wherein the supporting layer (11) is formed between two separated first conductive optical film stacks (20);

forming the spacing layer (12), wherein the spacing layer (12) is formed above each separated first conductive optical film stack (20) and is further flattened;

forming the plurality of second conductive optical film stacks (13), wherein these second conductive optical film stacks (13) are coated on the spacing layer (12) and the supporting layer (11), and the second conductive optical film stacks (13) are electrically connected to a portion of the plurality of the connecting pads (202); and

removing the spacing layer (12), wherein once the spacing layer (12) has been removed from the substrate (10), a gap is defined between the first and the second conductive optical film stacks (20)(13).

3. The method as claimed in claim 1, wherein the first conductive optical film stack (20) is formed by the step of:

sequentially forming a transparent conductive layer (21a), an absorption layer (22a) and a dielectric layer (24a) on the substrate (10).

4. The method as claimed in claim 2, wherein the first conductive optical film stack (20) is formed by the step of:

sequentially forming a transparent conductive layer (21a), an absorption layer (22a) and a dielectric layer (24a) on the substrate (10).

5. The method as claimed in claim 1, wherein the first conductive optical film stack (20) is formed by the step of:

sequentially forming a first dielectric layer (23b), a transparent conductive layer (21b), an absorption layer (22b) and a second dielectric layer (24b) on the substrate (10).

6. The method as claimed in claim 2, wherein the first conductive optical film stack (20) is formed by the step of:

sequentially forming a first dielectric layer (23b), a transparent conductive layer (21b), an absorption layer (22b) and a second dielectric layer (24b) on the substrate (10).

7. The method as claimed in claim 1, wherein the first conductive optical film stack (20) is formed by the step of:

sequentially forming a transparent conductive layer (21c), a first dielectric layer (23c), an absorption layer (22c) and a second dielectric layer (24c) on the substrate (10).

8. The method as claimed in claim 2, wherein the first conductive optical film stack (20) is formed by the step of:

sequentially forming a transparent conductive layer (21c), a first dielectric layer (23c), an absorption layer (22c) and a second dielectric layer (24c) on the substrate (10).

9. The method as claimed in claim 1, wherein the first conductive optical film stack (20) is formed by the step of:

sequentially forming a first dielectric layer (23d), an absorption layer (22d) a transparent conductive layer (21d) and a second dielectric layer (24d) on the substrate (10).

10. The method as claimed in claim 2, wherein the first conductive optical film stack (20) is formed by the step of:

sequentially forming a first dielectric layer (23d), an absorption layer (22d) a transparent conductive layer (21d) and a second dielectric layer (24d) on the substrate (10).

11. An optical interference display panel comprising:

a substrate on which a plurality of first conductive optical film stacks (20), a supporting layer (11) and a plurality of second conductive optical film stacks (13) are formed; and

a plurality of connecting pads (201)(202) formed near edges of the substrate (10), wherein the plurality of connecting pads (201)(202) are made of a transparent conductive layer (21) of the first conductive optical film stack (20).

12. The display panel as claimed in claim 11, the first conductive optical film stack (20) comprising a transparent conductive layer (21a), an absorption layer (22a) and a dielectric layer (24a) on the substrate (10), which are sequentially formed on the substrate (10).

13. The display panel as claimed in claim 11, the first conductive optical film stack (20) comprising a first dielectric layer (23b), a transparent conductive layer (21b), an absorption layer (22b) and a second dielectric layer (24b), which are sequentially formed on the substrate (10).

14. The display panel as claimed in claim 11, the first conductive optical film stack (20) comprising a transparent conductive layer (21c), a first dielectric layer (23c), an absorption layer (22c) and a second dielectric layer (24c), which are sequentially formed on the substrate (10).

15. The display panel as claimed in claim 11, the first conductive optical film stack (20) comprising a first dielectric layer (23d), an absorption layer (22d) a transparent conductive layer (21d) and a second dielectric layer (24d), which are sequentially formed on the substrate (10).