×

Apparatus for uniformly etching a dielectric layer

  • US 20040149394A1
  • Filed: 02/03/2003
  • Published: 08/05/2004
  • Est. Priority Date: 02/03/2003
  • Status: Active Grant
First Claim
Patent Images

1. Apparatus for plasma etching a layer of material upon a substrate, comprising:

  • an anode comprising a first region protruding from a second region, wherein the second region defines a plane and the first region extends from said plane.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×