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Electroplating solution containing organic acid complexing agent

  • US 20040149587A1
  • Filed: 01/22/2004
  • Published: 08/05/2004
  • Est. Priority Date: 02/15/2002
  • Status: Abandoned Application
First Claim
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1. A solution for use in connection with the deposition of one or more metals on electroplatable substrates, which comprises:

  • water;

    a metal ion in an amount sufficient to provide a metal deposit on a platable substrate;

    a complexing agent of an organic compound having between 4 and 18 carbon atoms which compound includes at least two hydroxyl groups and a five or six membered ring that contains at least one oxygen atom, with the compound being present in an amount sufficient to complex the metal to render it soluble in the solution and to inhibit oxidation of the metal; and

    a pH of the solution in the range of between 3.5 and 5.5, adjusted, if necessary, by the addition of a suitable pH adjusting agent;

    wherein the complexing agent and metal ion are present in a concentration ratio of between about 2;

    1 and 9;

    1 to reduce or minimize agglomeration of the substrates during electroplating.

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