Electroplating solution containing organic acid complexing agent
First Claim
1. A solution for use in connection with the deposition of one or more metals on electroplatable substrates, which comprises:
- water;
a metal ion in an amount sufficient to provide a metal deposit on a platable substrate;
a complexing agent of an organic compound having between 4 and 18 carbon atoms which compound includes at least two hydroxyl groups and a five or six membered ring that contains at least one oxygen atom, with the compound being present in an amount sufficient to complex the metal to render it soluble in the solution and to inhibit oxidation of the metal; and
a pH of the solution in the range of between 3.5 and 5.5, adjusted, if necessary, by the addition of a suitable pH adjusting agent;
wherein the complexing agent and metal ion are present in a concentration ratio of between about 2;
1 and 9;
1 to reduce or minimize agglomeration of the substrates during electroplating.
1 Assignment
0 Petitions
Accused Products
Abstract
A solution for use in connection with the deposition of one or more metals on electroplatable substrates. This solution includes water; a metal ion; and a complexing agent. The complexing agent is advantageously an organic compound having between 4 and 18 carbon atoms which includes at least two hydroxyl groups and a five or six membered ring that contains at least one oxygen atom. The compound is present in an amount sufficient to complex the metal in the solution and inhibit oxidation of the metal. In particular, the complexing agent and metal ion are present in a concentration ratio of between about 3:1 and 9:1 to reduce or minimize agglomeration of the substrates during electroplating. If necessary, a suitable pH adjusting agent can be included in the solution to maintain the pH of the solution in the range of between about 3.5 to 5.5. At the preferred pH range, the solution is particularly useful for electroplating composite articles that have electroplatable portions and non-electroplatable portions without deleteriously affecting the non-electroplatable portions.
31 Citations
20 Claims
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1. A solution for use in connection with the deposition of one or more metals on electroplatable substrates, which comprises:
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water;
a metal ion in an amount sufficient to provide a metal deposit on a platable substrate;
a complexing agent of an organic compound having between 4 and 18 carbon atoms which compound includes at least two hydroxyl groups and a five or six membered ring that contains at least one oxygen atom, with the compound being present in an amount sufficient to complex the metal to render it soluble in the solution and to inhibit oxidation of the metal; and
a pH of the solution in the range of between 3.5 and 5.5, adjusted, if necessary, by the addition of a suitable pH adjusting agent;
wherein the complexing agent and metal ion are present in a concentration ratio of between about 2;
1 and 9;
1 to reduce or minimize agglomeration of the substrates during electroplating. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 19)
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13. A solution for use in connection with the deposition of tin or tin-lead alloys on electroplatable substrates, which comprises:
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water;
a stannous ascorbate compound;
a complexing agent of an organic compound having between 4 and 18 carbon atoms which compound includes at least two hydroxyl groups and a five or six membered ring that contains at least one oxygen atom, with the compound being present in an amount sufficient to complex tin ions to render them soluble in the solution and to inhibit oxidation of the tin ions;
when desired, a divalent lead compound in an amount sufficient to deposit a tin-lead alloy from the solution; and
a pH of the solution in the range of between 3.5 and 5.5, adjusted, if necessary, by the addition of a suitable pH adjusting agent;
wherein the complexing agent and metal ion are present in a concentration ratio of between about 2;
land 9;
1 to reduce or minimize agglomeration of the substrates during electroplating. - View Dependent Claims (14, 15, 16, 17, 18, 20)
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Specification