Plasma processing apparatus

• US 20040149741A1
• Filed: 12/17/2003
• Published: 08/05/2004
• Est. Priority Date: 12/17/2002
• Status: Active Grant

• Current Assignee: Tokyo Electron Limited, Yasuyoshi Yasaka
• Original Assignee: Tokyo Electron Limited, Yasuyoshi Yasaka
• Inventors: Ishii, Nobuo, Yasaka, Yasuyoshi
• Granted Patent: US 6,953,908 B2
• Time in Patent Office: Days
• US Class Current: 219/678
• CPC Class Codes: H01J 37/32192 Microwave generated discharge H01J37/32357, H01J37/32366, H01J37/32394, H01J37/32403 take precedence
• CPC Class Codes: H01L 21/67069 for drying etching
• CPC Class Codes: H05B 6/72 Radiators or antennas
• CPC Class Codes: H05B 6/806 for laboratory use

Abstract

A plasma processing apparatus, comprising: at least, a plasma processing chamber for processing therein an object to be processed; antenna means for guiding microwaves into the plasma processing chamber; and a dielectric member disposed between the antenna means and the plasma processing chamber; wherein a surface of the dielectric member facing the inside of the plasma processing chamber has a projecting shape.

Claims

1. A plasma processing apparatus, comprising:

a plasma processing chamber for processing therein an object to be processed;

antenna means for guiding microwaves into the plasma processing chamber; and

a dielectric member disposed between the antenna means and the plasma processing chamber;

wherein a surface of the dielectric member facing the inside of the plasma processing chamber has a projecting shape.

2. A plasma processing apparatus according to claim 1, wherein the antenna means comprises a plane antenna (RLSA) member having plural slots.

3. A plasma processing apparatus according to claim 1, wherein the side of the dielectric member facing the inside of the plasma processing chamber is mirror-polished.

4. A plasma processing apparatus according to claim 1, wherein each corner-shaped or edge-shaped portion, and/or each crossing portion (cross-type shaped portion) of the dielectric member disposed in the inside of the plasma processing chamber has a curved surface.

5. A plasma processing apparatus according to claim 1, wherein the projecting shape is provided along the circumferential direction, and/or radial direction of the dielectric member.

6. A plasma processing apparatus according to claim 1, wherein the projecting shapes are provided so that they constitute a crossing-type arrangement in the longitudinal direction, transverse direction, and/or radial direction.

7. A plasma processing apparatus according to claim 5, wherein the crossing portion of the projecting shape assumes a cross shape.

8. A plasma processing apparatus according to claim 6, wherein the crossing portion of the projecting shape assumes a cross shape.

9. A plasma processing apparatus according to claim 5, wherein the formation of crossings of the projecting shapes is avoided.

10. A plasma processing apparatus according to claim 6, wherein the formation of crossings of the projecting shapes is avoided.

11. A plasma processing apparatus according to claim 1, wherein a plurality of projecting shapes are present, and at least some of the plural projecting shapes are mutually connected to each other.